Printed Circuit Board Plate Structure with Linear Openings for Bending Control
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Solution Overview
Problem
Printed circuit boards in semiconductor packages are prone to bending during the solder reflow process, leading to increased defect rates due to their small size and thickness.
Innovation Solution
Incorporating a substrate structure with a base layer and a plate structure featuring linear openings that help control bending properties by distributing thermal expansion evenly, reducing excessive deformation during high-temperature processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the size and thickness of the printed circuit board are reduced to achieve miniaturization, then the semiconductor package size is reduced, but the printed circuit board becomes easily bent by thermal atmosphere during solder reflow process
Solution Approach 1:
The plate structure is divided into multiple segments by forming openings (through-holes or vias) within it. This segmentation allows the structure to accommodate thermal expansion and contraction more effectively, preventing bending while maintaining a compact size. The openings create a grid-like pattern that distributes thermal stresses across multiple smaller regions rather than allowing stress to concentrate in a solid continuous plate.
Solution Approach 2:
The plate structure incorporates openings that create a porous or perforated configuration. This porous design reduces the overall mass and volume of the printed circuit board while maintaining structural integrity. The openings allow thermal atmosphere to pass through more evenly, reducing differential thermal expansion that causes bending, thus resolving the contradiction between miniaturization and bending resistance.
2Length of stationary object
If the printed circuit board is made thinner to achieve thinning, then the semiconductor package thickness is reduced, but the board becomes more susceptible to bending during high-temperature processes
Solution Approach 1:
The plate structure functions as a composite configuration combining solid material regions with void spaces (openings). This composite design provides high bending strength relative to the thin thickness by creating a structure that resists deformation through its geometric configuration. The pattern of openings and solid regions works together to distribute loads and prevent bending, enabling thin boards to maintain adequate strength during solder reflow processes.
3Stability of the object's composition
If openings are added to the plate structure to control bending, then thermal expansion is distributed evenly, but the manufacturing process becomes more complex
Solution Approach 1:
The openings in the plate structure serve multiple functions simultaneously: they control thermal expansion distribution, reduce overall weight and volume, improve bending resistance, and facilitate more uniform heat distribution during solder reflow. By integrating these multiple benefits into a single structural feature, the design achieves thermal management and mechanical strength improvement without proportionally increasing manufacturing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The substrate structure minimizes bending and deformation, thereby reducing defect rates in semiconductor package formation and enhancing the manufacturing productivity and noise reduction characteristics of the packages.
Implementation Method 1
A printed circuit board having a small size and/or thickness may be easily bent by the thermal atmosphere created in a solder reflow process
Data Source
AI summary
A printed circuit board that includes a base layer having a first surface and a second surface opposing each other. A first structure is disposed on the first surface of the base layer. The first structure includes a first plate structure. A first connection structure is disposed on a same plane as the first plate structure and is spaced apart from the first plate structure. The first plate structure includes first openings. At least some of the first openings are linear openings having a line shape.