Printed Circuit Board–Power Electronics Component Bonding via Laser Welding
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Solution Overview
Problem
Existing technologies face challenges in creating a compact and easily establishable arrangement of a printed circuit board with a power electronics component, particularly in forming a direct and stable electrically conductive connection between the circuit board and the power electronics component.
Innovation Solution
A method involving a laser-induced material-material bond is used to connect the first contact surface of the printed circuit board directly or indirectly with the second contact surface of the power electronics component, utilizing a bonding medium if needed, to form a weld or solder bond, ensuring accessibility of the opposite surface for the laser beam.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a direct material-material bond is formed between the printed circuit board and power electronics component, then electrical conductivity and mechanical stability are improved, but manufacturing complexity increases due to precise alignment requirements
Solution Approach 1:
A bonding medium is introduced as an intermediary substance between the first contact surface of the printed circuit board and the second contact surface of the power electronics component. This bonding medium facilitates the laser-induced material-material bond while accommodating minor misalignments and surface irregularities, thereby maintaining reliable electrical conductivity without requiring extremely precise alignment during manufacturing.
Solution Approach 2:
The invention utilizes laser beam parameters (energy density, pulse duration, wavelength) to control the bonding process. By adjusting these parameters, the laser can selectively melt or vaporize the bonding medium and contact surfaces to create a direct material-material bond with controlled properties, achieving reliable electrical connection while managing the complexity of the manufacturing process through parameter optimization.
2Ease of manufacture
If the opposite surface of the first conductor track is made accessible for laser beam, then welding operation is simplified, but the structural integrity may be compromised
Solution Approach 1:
The conductor track structure is segmented into multiple parts: the first conductor track with its opposite surface exposed for laser access, and the first contact surface that forms the bonding interface. This segmentation allows the laser to act on the opposite surface for bonding while the rest of the conductor track maintains its structural integrity and electrical function.
Solution Approach 2:
The bonding interface is created by accessing the opposite surface of the first conductor track in the normal direction, utilizing the third dimension (depth/thickness) of the conductor track. This dimensional approach allows laser welding to occur through or from the opposite surface without compromising the in-plane structural integrity of the printed circuit board.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables a compact and stable electrically conductive connection between the printed circuit board and power electronics component, enhancing mechanical stability and electrical conductivity.
Implementation Method 1
a laser-induced material-material bond is used to connect the first contact surface of the printed circuit board directly or indirectly with the second contact surface of the power electronics component
Implementation Method 2
utilizing a bonding medium if needed, to form a weld or solder bond, ensuring accessibility of the opposite surface for the laser beam
Data Source
AI summary
What are presented are a method of production and an arrangement having a printed circuit board and a power electronics component, wherein the component has a second contact surface having a normal direction, wherein the printed circuit board has a first conductor track having a first contact surface which is flush with the second contact surface in normal direction and is connected thereto in a materially bonded and electrically conductive manner, wherein the first contact surface is assigned an opposite surface of the first conductor track which is disposed above it in normal direction and which is accessible, especially to a laser beam, from normal direction, especially in the course of a welding operation.