Wafer-Level Optical Device Using PCB Prism Bodies

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Existing optical devices face challenges in manufacturability, cost-effectiveness, and miniaturization, particularly when high volumes of small optical devices with integrated light guide and optoelectronic functions are required.

Innovation Solution

The optical device is designed with two prism bodies and four side panels, where at least one constituent is made of non-transparent dielectric material, such as a printed circuit board, to facilitate cost-efficient manufacturing and integration of optoelectronic components, with reflectors for light redirection and hermetic sealing to prevent debris entry.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If traditional transparent materials like glass are used for light guide elements, then optical performance is maintained, but manufacturing cost and complexity increase

Engineering Contradiction:
ImprovemanufacturabilityVSAvoidmaterial cost
Core Design Contradiction:
Ease of manufactureVSQuantity of substance

Solution Approach 1:

The patent changes the material parameter from transparent (glass) to non-transparent dielectric material, fundamentally altering both optical and manufacturing properties. This enables standard PCB manufacturing techniques to be used, dramatically improving ease of manufacture and reducing material costs while maintaining functional performance through alternative optical designs.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent employs composite construction by integrating the light guide function into a PCB substrate that combines non-transparent dielectric material with embedded reflectors and optoelectronic components. This composite approach achieves both mechanical support and optical guidance functions simultaneously, reducing overall device complexity and manufacturing steps.

Inventive Principle:
Principle #40Composite materials

2Volume of moving object

If optical devices are miniaturized to reduce size, then device dimensions decrease, but manufacturing precision requirements increase

Engineering Contradiction:
Improvedevice sizeVSAvoiddimensional tolerance
Core Design Contradiction:
Volume of moving objectVSManufacturing precision

Solution Approach 1:

The patent makes the PCB substrate perform multiple functions simultaneously: structural support, light guidance, electrical connection, and component mounting. By consolidating these functions into a single standardized component, the design achieves miniaturization without proportionally increasing manufacturing precision requirements, as PCB fabrication is a mature, high-precision process.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent segments the optical device into modular components (prism bodies, side panels, reflectors, optoelectronic components) that can be independently manufactured and then assembled. This segmentation allows each component to be optimized and manufactured separately using appropriate processes, reducing overall device size while maintaining reasonable precision requirements through modular assembly.

Inventive Principle:
Principle #1Segmentation

3Productivity

If high volumes of optical devices are manufactured, then productivity increases, but device complexity must be reduced for mass production

Engineering Contradiction:
Improvemanufacturing volumeVSAvoidstructural complexity
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The patent designs a universal PCB-based platform that can accommodate different optoelectronic components and configurations while maintaining the same basic light guide structure. This universality enables high-volume manufacturing through standardized production processes, as the core light guide geometry remains constant across different device variants, reducing complexity for mass production.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent merges multiple discrete optical components (light guide, reflectors, mounting structures) into a single integrated PCB assembly. This consolidation reduces the number of separate manufacturing steps and assembly operations required, thereby increasing productivity and enabling high-volume production while maintaining functional complexity through integration rather than simplification.

Inventive Principle:
Principle #5Merging (Combining)

4Ease of manufacture

If non-transparent dielectric material is used instead of transparent material, then cost and manufacturability improve, but light transmission capability is reduced

Engineering Contradiction:
Improvemanufacturing costVSAvoidlight transmission
Core Design Contradiction:
Ease of manufactureVSIllumination intensity

Solution Approach 1:

The patent introduces reflectors as intermediary elements within the non-transparent dielectric structure to redirect and guide light. These reflectors act as mediators that enable light transmission and guidance functions without requiring the bulk material to be transparent, allowing the use of cost-effective non-transparent dielectric materials while maintaining optical performance through carefully positioned reflective surfaces.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent applies local quality by making specific regions of the PCB substrate transparent or semi-transparent where light transmission is required, while keeping other regions non-transparent for structural and cost reasons. This localized transparency approach maintains overall cost-effectiveness and manufacturability while preserving necessary light transmission paths through selective material properties in critical areas.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design enables the creation of highly manufacturable, cost-effective, and compact optical devices with integrated light guide and optoelectronic functions, reducing stray light and allowing for efficient mounting of optoelectronic components, while maintaining optical path integrity.

Implementation Method 1

a first reflector present at a first side face of the first prism body, and a second reflector is present at a second side face of the second prism body. At least one of the prism bodies and/or at least one of the side panels is at least in part made of a non-transparent dielectric material

Methodology Applied
Scientific EffectLight reflection: Reflection

Implementation Method 2

at least one of the prism bodies and/or at least one of the side panels is at least in part made of a non-transparent dielectric material

Methodology Applied
Scientific EffectLight absorption: Absorption (EM radiation)

Data Source

PatentUS10551602B2Wafer-level optical device having light guide properties
Publication Date: 2020.02.04 AMS OSRAM ASIA PACIFIC PTE LTD
  • US10551602B2 patent drawing
  • US10551602B2 patent drawing
  • US10551602B2 patent drawing

AI summary

An optical device (1) includes two prism bodies (41, 42) and four side panels (71-74) attached to both prism bodies (41, 42). A cavity (9) is thereby enclosed. A first reflector (81) can be present at a first side face (81) of the first prism body (41), and a second reflector (82) can be present at a second side face (82) of the second prism body (42). At least one of the prism bodies (41, 42) and/or at least one of the side panels (71-74) can be at least in part made of a non-transparent dielectric material such as a printed circuit board. In some implementations, an optoelectronic component (90) can be attached to the respective constituent of the optical device (1).