Printed Wiring Board Recessed Side Walls Insulating Layer Peeling
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Solution Overview
Problem
Existing printed wiring boards face challenges in filling the narrow spaces between adjacent conductor circuits with insulating layers, leading to potential peeling issues due to insufficient contact area and bonding between the layers.
Innovation Solution
The design includes a first resin insulating layer with a conductor layer featuring recessed side walls on adjacent conductor circuits, allowing a larger space to be filled by a second resin insulating layer, which increases the contact area and prevents peeling by smoothly filling the recessed areas.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the space between adjacent conductor circuits is reduced to increase circuit density, then the productivity and compactness of the printed wiring board are improved, but the contact area between insulating layers is reduced leading to peeling issues
Solution Approach 1:
The invention transitions from a two-dimensional planar arrangement to a three-dimensional stepped structure by forming side walls that extend upward from the conductor circuits. This vertical dimension creates additional bonding surface area between insulating layers without increasing the horizontal footprint, thereby maintaining high circuit density while improving layer bonding reliability.
Solution Approach 2:
The side walls are formed on the conductor circuits before the insulating layers are applied. This preliminary structuring creates pre-formed bonding surfaces that ensure adequate contact area between insulating layers is established in advance, preventing peeling issues before they occur during the layer stacking process.
2Area of stationary object
If the space between adjacent conductor circuits is reduced to increase circuit density, then the compactness of the printed wiring board is improved, but the contact area between insulating layers is reduced leading to peeling issues
Solution Approach 1:
By extending side walls vertically from the conductor circuits, the invention creates additional bonding interface area in the vertical dimension. This allows the insulating layers to have sufficient contact area for reliable bonding while maintaining a compact horizontal board footprint, effectively resolving the contradiction between area utilization and bonding reliability.
Solution Approach 2:
The side walls form a nested structure where the first insulating layer conforms to the stepped profile created by the side walls, and the second insulating layer similarly conforms to the combined profile. This nested arrangement maximizes the bonding contact area within the limited horizontal space between adjacent conductor circuits.
3Reliability
If recessed side walls are formed on conductor circuits to increase insulating layer contact area, then the bonding reliability is improved, but the manufacturing complexity increases
Solution Approach 1:
The side walls are formed as a preliminary step before applying the insulating layers. By preparing the stepped structure in advance, the subsequent insulating layer application becomes simpler and more reliable, as the layers can directly conform to the pre-formed surfaces without requiring complex in-situ shaping processes.
Solution Approach 2:
The side walls create a stepped profile that provides curved or angled surfaces for the insulating layers to conform to. This geometric modification increases the effective contact area between layers while maintaining a relatively simple manufacturing approach, as the stepped structure can be formed using standard photolithography and etching processes.
Data Source
AI summary
A printed wiring board includes a first insulating layer, a conductor layer, and a second insulating layer. The conductor layer includes first and second circuits such that space is formed between the circuits, the first circuit has first and second side walls, the second circuit has third and fourth side walls such that the second wall faces the third wall, the first circuit has first, second and third portions, the second circuit has fourth, fifth and sixth portions such that the first and fourth portions, the second and fifth portions and the third and sixth portions face each other, the first circuit is formed such that the second wall of the second portion is recessed from the second wall of the first and third portions, and the first insulating layer has recess between the second and fifth portions such that the second insulating layer is filling the space and recess.