PCB-Shielded Optical Isolation Link With Rigid Transfer Rod
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Solution Overview
Problem
Existing optical signal transmission apparatuses face limitations in shielding effectiveness for high transient voltages, leading to insufficient common mode rejection, and require significant space and energy resources, while also being prone to environmental influences and ageing.
Innovation Solution
The implementation of metallic layers on printed circuit boards for shielding, combined with a rigid, transparent transfer rod as an optical transmission path, which is mechanically held by the printed circuit boards, providing enhanced shielding and resistance to environmental factors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If complex shielding bonnets are used to improve common mode rejection, then shielding effectiveness is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent combines multiple shielding functions into a single integrated printed circuit board structure. The PCB serves as both the mechanical support and the shielding assembly, with metallic layers deposited directly on the board to provide electrostatic shielding. This merging eliminates the need for separate complex shielding bonnets while maintaining effective common mode rejection.
Solution Approach 2:
The patent replaces traditional mechanical shielding structures (complex shielding bonnets) with an electromagnetic field-based solution using metallic layers on the PCB. The metallic layers create electrostatic shields that reject common mode interference without requiring complex mechanical assemblies, thereby simplifying the overall device structure.
2Object-affected harmful factors
If shielding distance is increased to reduce capacitive coupling, then interference is reduced, but device volume increases
Solution Approach 1:
The patent introduces an intermediate electrostatic shield (metallic layer on the PCB) between the transmitter and receiver circuits. This intermediate shielding layer acts as a mediator that blocks capacitive coupling and electromagnetic interference without requiring increased physical distance between components, thus maintaining compact device volume while reducing interference.
3Illumination intensity
If transparent materials are used for shielding, then optical transmission is enabled, but shielding effectiveness is reduced
Solution Approach 1:
The patent nests the optical transmission path within the shielding structure. The transparent transfer rod is positioned within the electrostatic shield formed by the metallic layers on the PCB. This nested configuration allows optical signals to pass through the transparent rod while the surrounding metallic shield provides effective electromagnetic shielding, combining both optical transmission and shielding effectiveness.
4Ease of manufacture
If metallic layers are used instead of complex shielding structures, then manufacturing cost is reduced, but shielding effectiveness may be compromised
Solution Approach 1:
The patent changes the parameters of the shielding implementation by using standard PCB metallic layer deposition processes instead of complex mechanical shielding assemblies. By optimizing the thickness and configuration of these metallic layers, the patent achieves effective shielding performance at lower manufacturing cost and with simpler fabrication processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration achieves high common mode rejection, low energy consumption, and resistance to ageing and environmental influences, enabling reliable and efficient signal transmission with a compact, cost-optimized design suitable for applications in isolation amplifiers and safety-related fields.
Implementation Method 1
an implementation of the shielding assemblies by metallic layers in and/or on at least one printed circuit board
Implementation Method 2
an optical transmission path between the signal transmitter and the signal receiver in the form of a substantially rigid, transparent transfer rod
Data Source
AI summary
A potential-separating optical signal transmission device comprisesa printed circuit board-based transmitter device with a signal input, a transmission signal conditioning circuit and an optical signal transmitter,a printed circuit board-based receiver device with an optical signal receiver, a received signal processing circuit and a signal output,an optical transmission path between the signal transmitter and the signal receiver,a shield assembly for each transmitter and receiver device,an implementation of the shield assemblies by means of metallic layers in and/or on at least one printed circuit board, anda substantially rigid, transparent transfer rod as an optical transmission path,the ends of said transfer rod being arranged within the respective shield assembly of the transmitter and receiver device in front of the signal transmitter and signal receiver, respectively, andbeing mechanically held by the at least one printed circuit board.