PCB Shielding Structure With Slit Ground Planes Against Warpage
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Solution Overview
Problem
In electronic devices, the bending of substrates during high-temperature surface mount device processes can cause detachment of stacked substrates and interposers, leading to open connections between conductive terminals, which results in defects and reduced device quality.
Innovation Solution
The implementation of a substrate with a shielding structure featuring a second substrate having a metal layer with slits and ground vias, which adjusts the copper ratio and prevents detachment by ensuring proper alignment and electrical connectivity between substrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple substrates are stacked to increase component mounting space efficiency, then the device can be made slimmer and components can be mounted more efficiently, but the substrates may detach from each other during high-temperature surface mount device processes due to differential bending
Solution Approach 1:
The patent modifies the copper ratio parameter in the substrate structure by introducing slits into the copper layer. This parameter change allows the substrate to maintain proper flexibility and thermal expansion characteristics during high-temperature processes, preventing detachment while preserving electrical connectivity. The copper ratio adjustment directly addresses the differential bending issue without compromising the stacked substrate configuration.
Solution Approach 2:
The continuous copper layer in the substrate is segmented by introducing multiple slits, creating a patterned copper structure. This segmentation allows different regions of the substrate to expand and contract independently during temperature changes, reducing stress concentration and preventing detachment between stacked substrates while maintaining overall electrical connectivity through the remaining copper portions.
Data Source
AI summary
Certain embodiments of the disclosure relate to an electronic device including a substrate having a shielding structure. The electronic device may include a first substrate, a second substrate, and a third substrate. The second substrate may include a first metal pattern connected to ground and including multiple first slits formed by removing a portion of the first metal pattern, each of the first slits having a cross shape, a second metal pattern connected to the ground and including multiple second slits formed by removing a portion of the second metal pattern, each of the second slits having the cross shape, and multiple ground vias extending through at least a portion of the second substrate so as to connect the first metal pattern of the first metal layer to the second metal pattern of the second metal layer. Various other embodiments are also disclosed.