PCB Slit Design for Vibration Isolation
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Solution Overview
Problem
Existing printed circuit boards fail to effectively prevent lead breakage due to vibration propagation from heavy components, particularly when subjected to repeated vibrations.
Innovation Solution
A printed circuit board design that includes a slit between a heavy component and a power device, which suppresses vibration propagation and prevents lead breakage by providing a slit that penetrates the substrate, with a width ranging from 1.0 mm to 4.0 mm, effectively blocking vibration transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a heavy component is mounted on the substrate, then electric energy or inductive energy can be accumulated, but vibration propagates to other components causing lead breakage
Solution Approach 1:
The substrate is divided into separate regions by providing a slit between the heavy component and the power device. This segmentation prevents vibration generated by the heavy component from propagating to the power device and its leads, thereby protecting the leads from breakage while maintaining the functional integrity of both components
2Object-affected harmful factors
If a slit is provided between components, then vibration propagation is suppressed, but the substrate structure is modified
Solution Approach 1:
A slit is extracted or removed from the continuous substrate structure to create a discontinuity that blocks vibration propagation. This simple modification effectively isolates the power device from vibration generated by the heavy component without requiring complex additional structures or components
Data Source
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AI summary
An object of the present disclosure is to provide a printed circuit board that prevents breakage of a lead of a mounted component due to vibration of a heavy component on a substrate. A printed circuit board (100) includes a first component (10) that is a heavy component that accumulates electric energy or inductive energy, a second component (20) that is a power device having a plurality of leads (200), and a substrate (30) on which a first component (10) and a second component (20) are mounted. In the substrate (30), a slit (30a) is provided between the first component (10) and the second component (20), and a lead of the second component (20) is soldered. In the printed circuit board (100), the slit (30a) suppresses propagation of vibration from the heavy first component (10) to the second component (20), thereby preventing the leads (200) from breaking due to the vibration.