Printed Circuit Board Stacked Metal Structure for Etching Uniformity
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Solution Overview
Problem
The uniformity of circuit formation on printed circuit boards is degraded due to etching issues during the manufacturing process of ultra-thin copper layers, which affects the performance and reliability of compact mobile devices.
Innovation Solution
A printed circuit board design featuring a stacked metal structure with a first and second copper layer, and a metal layer in between, where the metal layer includes a material different from copper, such as titanium or silver, to improve circuit uniformity and reduce the risk of electrical characteristic loss, with a second insulating layer covering the metal and circuit layers to enhance structural integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Weight of stationary object
If an ultra-thin copper layer is used as the carrier, then the printed circuit board can be made lighter and thinner, but the uniformity of circuit formation is degraded due to etching issues
Solution Approach 1:
The patent applies composite materials by stacking multiple copper layers (first copper layer, second copper layer) with an intermediate metal layer between them. This composite structure compensates for the etching-induced non-uniformity in ultra-thin copper layers by providing additional copper material that ensures sufficient copper content and uniform circuit formation after etching.
2Device complexity
If a single copper layer is used, then the structure is simpler, but the risk of electrical characteristic loss is higher
Solution Approach 1:
The patent segments the copper conductor into multiple separate copper layers (first copper layer and second copper layer) with an intermediate metal layer between them. This segmentation allows each copper layer to contribute to the overall electrical characteristics, providing redundancy and stability against electrical characteristic loss that would occur in a single-layer structure.
Solution Approach 2:
The patent transitions from a two-dimensional single-layer copper structure to a three-dimensional stacked multi-layer copper structure. By adding the vertical dimension with multiple copper layers separated by an intermediate layer, the patent enhances electrical characteristic stability while managing the complexity through structured layering.
Data Source
AI summary
A printed circuit board includes a first insulating layer, a metal layer disposed on one surface of the first insulating layer, a first circuit layer disposed inside the first insulating layer and having one surface exposed to the one surface of the first insulating layer so as to be in contact with one surface of the metal layer, a second circuit layer in contact with the other surface of the metal layer, and a second insulating layer disposed on the one surface of the first insulating layer to cover the metal layer and the second circuit layer. The first and second circuit layers respectively include a metal different from the metal layer.