PCB Strain Inspection Device with Crack Guide Through Hole
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Solution Overview
Problem
Existing strain inspection methods for printed circuit boards (PCBs) are inadequate for quickly and easily detecting mechanical damage caused by pressure during assembly, as they require complex measurements and are not easily visible to the naked eye.
Innovation Solution
A strain inspection device comprising a damage indicator with a crack guide through hole, typically diamond or square shaped, attached to the PCB using a bonding agent, which cracks along the hole's corners due to PCB deformation, allowing for visual estimation of damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If complex measurement methods are used to detect PCB mechanical damage, then measurement precision is improved, but device complexity and ease of operation deteriorate
Solution Approach 1:
The patent introduces a damage indicator as an intermediary element that transfers the mechanical stress from the PCB to a visible crack pattern. The indicator includes a through-hole that acts as a stress concentrator, mediating between the invisible PCB deformation and the visible crack formation, thereby enabling simple visual detection while maintaining measurement precision.
Solution Approach 2:
The damage indicator utilizes visual changes (crack formation and propagation) as a direct indication of PCB damage. The crack pattern's visibility, length, and direction provide immediate visual feedback about the extent and nature of mechanical damage, eliminating the need for complex measurement instruments.
2Measurement precision
If complex measurement methods are used to detect PCB mechanical damage, then measurement precision is improved, but ease of operation deteriorates
Solution Approach 1:
The damage indicator serves as a mediator that converts complex mechanical stress states into simple visual crack patterns. Inspectors can easily observe and assess PCB damage by looking at the crack formation on the indicator, eliminating the need for complex measurement operations while maintaining detection accuracy.
Solution Approach 2:
The damage indicator performs the measurement function automatically through self-service. The crack formation occurs naturally in response to PCB deformation without requiring external measurement equipment or complex operational procedures. The indicator itself provides the measurement information through its crack pattern.
3Difficulty of detecting and measuring
If crack guide through hole is formed in damage indicator, then ease of detecting damage is improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent optimizes the through-hole parameters (size, shape, position) to achieve the desired stress concentration effect. By carefully selecting and standardizing these parameters, the system achieves high damage detectability while keeping manufacturing precision requirements within acceptable ranges. The through-hole acts as a controlled stress concentrator that guides crack formation.
Solution Approach 2:
The through-hole is pre-formed in the damage indicator before attachment to the PCB. This preliminary action creates a predetermined stress concentration point that will guide crack formation during PCB deformation. The pre-positioned hole ensures consistent and reliable crack patterns without requiring high precision during the actual damage event.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables easy and quick assessment of PCB damage by cracking visibly along the through holes, providing a clear indication of deformation severity and allowing for accurate strain measurement.
Implementation Method 1
fixedly attaching the glass plate with the crack guide through hole formed thereon to the PCB by using a bonding agent or an adhesive
Implementation Method 2
cracked or damaged along a corner of the crack guide through hole due to deformation of the PCB
Data Source
AI summary
A strain inspection device of a printed circuit board (PCB) which is easily cracked or damaged by external pressure (force) applied to the PCB while the PCB is being assembled, and an attaching method thereof. The strain inspection device of a printed circuit board (PCB) includes a fixing member; and a damage indicator fixed to the PCB by the fixing member, having a crack guide through hole, and cracked or damaged along a corner of the crack guide through hole due to deformation of the PCB.