Via Hole With Conductive And Insulating Bars For PCB Miniaturization

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Solution Overview

Problem

The size reduction of printed circuit boards is limited by the number and spacing of via holes and interference between signal lines, restricting further miniaturization due to the need for each circuit connection requiring a via hole.

Innovation Solution

The printed circuit board design features a via hole with an inner conductive bar and insulating bar, where the pad is located at the edge and connected to the conductive bar, allowing multiple conductive bars to share a via hole and increasing the distance between signal lines, reducing crosstalk and enabling smaller board sizes.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If a via hole is used for each circuit connection, then circuit connections are achieved, but the size and number of via holes restrict the size reduction of the printed circuit board

Engineering Contradiction:
Improvecircuit connection capabilityVSAvoidprinted circuit board size
Core Design Contradiction:
Adaptability or versatilityVSArea of stationary object

Solution Approach 1:

Multiple conductive bars are merged within a single via hole structure, allowing one via hole to serve multiple circuit connections simultaneously. The via hole contains multiple conductive bars (e.g., first conductive bar and second conductive bar) that can each connect to different signal lines, thereby reducing the total number of via holes needed and enabling smaller printed circuit board size.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The via hole structure is designed with multi-functionality by incorporating multiple conductive bars that can perform different connection functions. The via hole can simultaneously provide electrical connections for multiple signals or ground references, making a single via hole serve multiple purposes and reducing the overall via hole count required for complete circuit connectivity.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Area of stationary object

If the pad at the edge of the via hole is too close to the signal line, then space is saved, but interference occurs between the pad and signal line

Engineering Contradiction:
Improvespace utilizationVSAvoidinterference between pad and signal line
Core Design Contradiction:
Area of stationary objectVSObject-affected harmful factors

Solution Approach 1:

An insulating bar is introduced as an intermediary element between the pad and the signal line. The insulating bar physically separates the pad (located at the edge of the via hole) from the signal line, preventing electrical interference while still allowing the pad to be positioned close to the signal line for space efficiency. The insulating bar acts as a mediator that maintains both proximity and electrical isolation.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The via hole structure employs local quality differentiation by using insulating bars in specific locations where electrical isolation is needed. The insulating bars are positioned between the pad and adjacent signal lines to provide localized electrical isolation, while other areas of the via hole maintain good electrical conductivity for signal transmission. This localized application of insulating properties allows space-saving pad placement without interference.

Inventive Principle:
Principle #3Local quality

Data Source

PatentUS9125314B2Printed circuit board
Publication Date: 2015.09.01 CELESTICA TECH CONSULTANCY SHANGHAI
  • US9125314B2 patent drawing
  • US9125314B2 patent drawing
  • US9125314B2 patent drawing

AI summary

A printed circuit board includes: an insulating substrate, and a patterned conductive layer having a signal line and fixed on the insulating substrate, where signal lines on different planes of the patterned conductive layer are electrically connected to a via hole through a pad. An inner wall of the via hole is formed of a conductive bar and an insulating bar that penetrate the via hole; the pad is at an edge of the via hole and is connected to the conductive bar; the pad has an unclosed structure. In the printed circuit board according to the present invention, the size of the pad is significantly reduced by arranging the pad at partial edge of the via hole, thereby effectively improving a layout density of the patterned conductive layer, hence reducing the size of the printed circuit board, and satisfying the market demand for smaller electronic products.