PCB Via-Hole Jig Structure for Flatness and Positional Accuracy

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Solution Overview

Problem

The challenge in printed circuit board manufacturing is the occurrence of wrinkles and reduced flatness during via hole processing, leading to positional accuracy and shape distortion issues, which affect the reliability of the board.

Innovation Solution

A jig with a unique suction hole design, featuring first and second hole portions aligned perpendicular to each other, maximizes the suction area without losing suction power, ensuring the workpiece's flatness and improving the positional accuracy and uniformity of via holes formed.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Area of stationary object

If a conventional suction hole design is used in the jig, then the structure is simple, but the suction area is insufficient causing workpiece flatness deterioration and wrinkles

Engineering Contradiction:
Improvesuction areaVSAvoidjig structure complexity
Core Design Contradiction:
Area of stationary objectVSDevice complexity

Solution Approach 1:

The suction hole is divided into multiple segments (first suction hole portion and second suction hole portion) extending in different directions from a central axis. This segmentation increases the total suction area while maintaining a relatively simple overall jig structure, resolving the contradiction between suction area and structural complexity.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The suction hole design transitions from a conventional single-direction or circular shape to a multi-dimensional structure with portions extending in different directions (first direction and second direction perpendicular to each other). This dimensional expansion maximizes the suction area without proportionally increasing structural complexity.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Stability of the object's composition

If the suction area is increased to maintain flatness, then workpiece flatness is maintained, but suction power may be reduced due to larger hole size

Engineering Contradiction:
Improveworkpiece flatnessVSAvoidsuction power
Core Design Contradiction:
Stability of the object's compositionVSForce

Solution Approach 1:

By segmenting the suction hole into multiple portions distributed around the central axis, the design maintains suction power through distributed pressure zones while achieving increased total suction area. This segmentation allows the workpiece to be held flat without sacrificing the vacuum strength needed for secure fixation.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Each suction hole portion is strategically positioned and sized to create optimal local suction zones. The first and second suction hole portions have different orientations and dimensions, creating varied local suction characteristics that collectively maintain both overall suction power and workpiece flatness.

Inventive Principle:
Principle #3Local quality

3Productivity

If laser processing is performed on the workpiece, then via holes are formed efficiently, but heat causes expansion and contraction leading to surface wrinkles and flatness loss

Engineering Contradiction:
Improvevia hole processing efficiencyVSAvoidworkpiece flatness
Core Design Contradiction:
ProductivityVSStability of the object's composition

Solution Approach 1:

The multi-portion suction hole structure is prepared in advance to provide enhanced flatness maintenance capability before laser processing begins. This preliminary structural configuration ensures that when heat-induced expansion and contraction occur during laser via hole formation, the workpiece remains stable and wrinkle-free throughout the processing operation.

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution maintains the flatness of the workpiece, enhances the positional accuracy and shape uniformity of via holes, and reduces the size distribution of via holes, thereby improving the processing capability and reliability of the printed circuit board.

Implementation Method 1

a plurality of first suction holes for sucking and supporting the workpiece by suction air provided through the suction portion

Methodology Applied
Scientific EffectSuction: Suction

Data Source

PatentUS12156347B2Jig for via-hole processing, via-hole processing device, and via-hole processing method using same
Publication Date: 2024.11.26 LG INNOTEK CO LTD
  • US12156347B2 patent drawing
  • US12156347B2 patent drawing
  • US12156347B2 patent drawing

AI summary

A jig for processing a via hole according to an embodiment is an auxiliary member having a plate shape disposed between a processing plate in which a suction portion is disposed at a lower portion and a workpiece, wherein the auxiliary member includes a plurality of first suction holes for sucking and supporting the workpiece by suction air provided through the suction portion, and each of the plurality of first suction holes includes a first suction hole portion extending in a first direction, and a second hole portion extending in a second direction different from the first direction, wherein the first direction is perpendicular to the second direction.