PCB Waveguide Antenna Structure Without Microstrip Transition
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Solution Overview
Problem
Conventional waveguide type antennas face issues with signal transition from microstrip to waveguide, leading to high costs, manufacturing challenges, and signal loss, necessitating a new design that eliminates the need for such a transition structure.
Innovation Solution
A waveguide antenna structure is developed with a printed circuit board (PCB) laminated design, incorporating a metal cover layer with openings to alter RF signal paths, and a feed hole connected to a waveguide layer, antenna layer, and base layer, using via holes to prevent radio wave leakage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a structure for transitioning signal from microstrip to waveguide is used, then signal transmission is enabled, but manufacturing complexity and cost increase
Solution Approach 1:
The patent removes the separate signal transition structure from the conventional design. Instead of having a distinct microstrip-to-waveguide transition component, the waveguide is directly integrated with the PCB substrate, allowing the signal to transition inherently through the layered structure without additional transition elements.
Solution Approach 2:
The patent combines the waveguide structure with the PCB substrate by laminating the waveguide layer directly onto the base layer. This merging eliminates the need for separate transition structures and integrates multiple functions (signal transmission, structural support, and transition) into a unified layered assembly.
2Adaptability or versatility
If a metal cover layer with opening is laminated on antenna layer, then RF signal path is changed, but manufacturing complexity increases
Solution Approach 1:
The metal cover layer serves multiple functions: it provides electromagnetic shielding, defines the RF signal path through its opening, and can be integrated with the PCB lamination process. This multi-functionality allows signal characteristic customization without proportionally increasing manufacturing complexity.
Solution Approach 2:
The patent utilizes the vertical dimension by laminating the metal cover layer onto the antenna layer. The opening in the metal cover layer creates a three-dimensional RF signal path that can be controlled by adjusting the opening's position, size, and shape, enabling signal characteristic customization through vertical layering rather than complex lateral structures.
3Reliability
If via holes are formed to surround feed hole and waveguide, then radio wave leakage is prevented, but manufacturing steps increase
Solution Approach 1:
The via holes are formed during the PCB lamination process itself, before final assembly. The via holes are created as part of the base layer, waveguide layer, and antenna layer fabrication, allowing radio wave leakage prevention to be built into the structure during manufacturing rather than requiring separate post-processing steps.
Solution Approach 2:
The via holes are uniformly distributed around the feed hole and waveguide structure, creating a homogeneous shielding effect. This uniform arrangement provides effective radio wave leakage prevention through consistent electromagnetic containment while using a simple, repeatable manufacturing pattern.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution reduces signal loss and manufacturing complexity while allowing for customizable beam patterns and signal characteristics, enhancing antenna performance and efficiency.
Implementation Method 1
a metal cover layer laminated on the antenna layer and including a first opening surrounding the antenna to change a path of a radio wave transmitted or received through the antenna
Implementation Method 2
a waveguide layer laminated on the base layer and including a waveguide communicating with the feed hole
Data Source
AI summary
A waveguide antenna structure is provided. A waveguide antenna structure according to one embodiment of the present disclosure includes a base layer in which a feed hole is formed, a waveguide layer laminated on the base layer and including a waveguide communicating with the feed hole, an antenna layer laminated on the waveguide layer and including an antenna for transmitting or receiving a signal passing through the feed hole and the waveguide to or from an outside, and a metal cover layer laminated on the antenna layer and including a first opening surrounding the antenna to change a path of a radio wave transmitted or received through the antenna.


