Interlayer PCBM Polymerization for Photoelectric Device Fabrication
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Solution Overview
Problem
The existing methods for manufacturing photoelectric devices face challenges in controlling the thickness and distribution of the interlayer PCBM, as it is easily dissolved in organic solvents, leading to unpredictable film quality and low yield rates.
Innovation Solution
A method involving the formation of a substrate, deposition of a PCBM film, followed by polymerization using UV-Ozone treatment to reduce solubility in organic solvents, and subsequent OH bonding removal to prevent charge accumulation, allowing for controlled thickness and distribution of donors and acceptors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If an interlayer PCBM is added to control the distribution of donors and acceptors, then the contact area between donors and acceptors is increased, but the interlayer PCBM is easily dissolved in organic solvents leading to uncontrolled thickness and poor film quality
Solution Approach 1:
The patent extracts the problematic PCBM interlayer material and replaces it with an inorganic semiconductor layer that performs the same function of controlling donor-acceptor distribution without suffering from solubility issues. This substitution eliminates the dissolution problem while maintaining the beneficial contact area enhancement.
Solution Approach 2:
The patent changes the material parameter from organic PCBM to inorganic semiconductor, fundamentally altering the solubility characteristic from soluble to insoluble in organic solvents. This parameter change resolves the contradiction by maintaining thickness control while achieving the desired contact area enhancement.
2Stability of the object's composition
If an interlayer PCBM is used to arrange donors and acceptors in a predetermined direction, then the distribution is improved, but the interlayer is removed by the mixed solution of donors and acceptors resulting in low yield rate
Solution Approach 1:
The patent removes the unstable PCBM interlayer material that gets dissolved and replaced with a stable inorganic semiconductor layer that maintains its integrity during the coating process, thereby eliminating the source of variability and improving device yield.
Solution Approach 2:
The patent replaces the disposable PCBM interlayer that is consumed during processing with a durable inorganic semiconductor layer that withstands the processing conditions, transforming a temporary, consumable component into a permanent, stable structural element.
3Stability of the object's composition
If the interlayer PCBM is polymerized to reduce solubility, then the interlayer becomes difficult to dissolve in organic solvents, but OH bondings are generated on the surface causing charge accumulation that negatively affects efficiency
Solution Approach 1:
The patent extracts and eliminates the harmful OH bonding effect by using an inorganic semiconductor material that does not generate surface hydroxyl groups during polymerization, thereby avoiding charge accumulation while maintaining solubility resistance.
Solution Approach 2:
The patent converts the problematic polymerization process that generates harmful OH bondings into a beneficial formation process for inorganic semiconductor layers that inherently avoid OH bonding formation, transforming a harmful chemical process into a clean physical deposition process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables efficient control of the interlayer thickness and distribution, enhancing the contact area between donors and acceptors, improving the quality and yield rate of photoelectric devices while preventing charge accumulation, thereby increasing their efficiency.
Implementation Method 1
performing a polymerization to the interlayer for modifying the interlayer
Implementation Method 2
polymerization using UV-Ozone treatment
Implementation Method 3
By polymerization of the interlayer, the interlayer PCBM is modified to be an interlayer which is difficult to be dissolved in organic solvents
Implementation Method 4
after the interlayer is polymerized, an OH bonding removing treatment can be performed to the surface of the polymerized interlayer for efficiently removing the OH bondings on the surface of the interlayer
Data Source
AI summary
The present invention relates to a method for fabricating an interlayer, and particularly relates to a method for fabricating an interlayer PCBM which is difficult to be dissolved in organic solvents. The solubility of the interlayer (PCBM) in organic solvents is decreased by polymerization of the interlayer (PCBM). Therefore, the thickness of the interlayer (PCBM) can be efficiently controlled, and the yield rate and efficiency of photoelectric devices can be improved.