Phase Change Material Thermal Management Between Stacked Circuit Boards
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Solution Overview
Problem
Conventional stack-up printed circuit boards face inefficiencies in heat dissipation and transmission as the performance of components improves, leading to inadequate thermal management.
Innovation Solution
Incorporating a phase change material (PCM) within the internal space between two circuit boards, connected by a connecting member, to absorb and manage heat generated by circuit elements, enhancing thermal conductivity and preventing heat escape.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If conventional thermal interface material (TIM) is used between circuit boards, then the structure is simple and easy to manufacture, but heat dissipation efficiency is insufficient as component performance improves
Solution Approach 1:
The patent utilizes phase change material (PCM) that transitions between solid and liquid states to absorb and store heat energy. The PCM is positioned in contact with the rear surface of the heat-generating component, absorbing excess heat through phase transition, thereby improving heat dissipation efficiency without requiring complex active cooling systems.
Solution Approach 2:
The patent employs a composite thermal management structure combining conventional thermal interface material (TIM) with phase change material (PCM). This composite approach integrates the heat transfer capabilities of TIM with the heat absorption and storage properties of PCM, achieving superior thermal management performance while maintaining manufacturing feasibility.
2Area of stationary object
If stack-up printed circuit boards are used to reduce area, then device footprint is minimized, but heat transmission efficiency deteriorates due to limited space for thermal management
Solution Approach 1:
The patent transitions from planar heat dissipation approaches to three-dimensional thermal management by stacking multiple circuit boards with PCM layers between them. This vertical arrangement enables effective heat absorption and transmission in the Z-direction, maintaining compact device footprint while improving heat management through additional thermal dimensionality.
3Productivity
If high-performance components are mounted on printed circuit board, then device functionality and processing power are improved, but heat generation increases beyond the capability of conventional TIM to dissipate
Solution Approach 1:
The patent changes the thermal parameters of the heat dissipation system by introducing PCM with high latent heat of fusion. This material parameter enables the system to absorb large amounts of heat energy during phase transition, significantly enhancing the heat dissipation capability to match the thermal output of high-performance components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The electronic device effectively dissipates and transmits heat, delaying temperature rise and improving thermal management by utilizing the PCM's latent heat absorption and storage properties.
Implementation Method 1
a phase change material (PCM) disposed in the internal space and configured to change the state thereof by absorbing heat generated by the at least some circuit elements
Implementation Method 2
utilizing the PCM's latent heat absorption and storage properties
Implementation Method 3
a connecting member disposed between the first circuit board and the second circuit board... to electrically connect the first circuit board and the second board
Data Source
AI summary
Various embodiments of the present invention relate to an electronic device including a stacked circuit board. The electronic device comprises: a first circuit board; a second circuit board; one or more circuit elements disposed on the second circuit board; and a connecting member disposed between the first circuit board and the second circuit board facing the first circuit board to form an internal space surrounding at least some of the one or more circuit elements, and to electrically connect the first and second circuit boards, wherein the internal space may be filled with a phase change material (PCM) that absorbs heat generated by the at least some circuit elements to change the state of the material. Various other embodiments of the present invention may be additionally provided.