Pd Electrode Segmentation for Semiconductor Light Emitting Device Adhesion
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Solution Overview
Problem
The poor adhesion of Pd electrodes to insulating films in semiconductor light emitting devices leads to peeling issues, which reduces manufacturing yield and causes voids in pad electrodes, potentially degrading device characteristics due to direct contact with the p-type contact layer.
Innovation Solution
A method involving the formation of a Pd electrode with an insulating film covering portion that is deliberately peeled off using a liquid spray jet device, eliminating the need for an adhesive layer and preventing material flaking onto the device surface, while ensuring the contact covering portion remains intact.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the Pd electrode is formed on the insulating film to ensure sufficient process margin, then the manufacturing precision is improved, but the adhesion between Pd electrode and insulating film deteriorates, causing peeling
Solution Approach 1:
The Pd electrode is divided into two distinct portions: a contact covering portion that remains on the insulating film to ensure process margin, and an insulating film covering portion that is deliberately peeled off. This segmentation allows the electrode to simultaneously achieve both sufficient process margin and reliable adhesion where needed.
Solution Approach 2:
The harmful insulating film covering portion of the Pd electrode is extracted and removed from the device surface through deliberate peeling. This eliminates the source of peeling problems and material flaking while retaining the beneficial contact covering portion that ensures process margin.
2Reliability
If an adhesive layer is formed between the insulating film and Pd electrode to enhance adhesion, then the reliability is improved, but the device complexity increases due to additional process steps
Solution Approach 1:
Instead of adding an adhesive layer, the solution extracts and removes the problematic insulating film covering portion of the Pd electrode. This eliminates the need for additional adhesive layers and associated process steps, maintaining simplicity while achieving reliable adhesion.
Solution Approach 2:
The insulating film covering portion of the Pd electrode is discarded through deliberate peeling and removal, while the contact covering portion is recovered and retained on the device. This approach achieves reliable adhesion without the complexity of adding adhesive layers.
3Manufacturing precision
If the insulating film covering portion of the Pd electrode is not removed, then the manufacturing precision is maintained, but material flakes adhere to the device surface, reducing manufacturing yield
Solution Approach 1:
The insulating film covering portion of the Pd electrode is extracted and removed from the device surface through deliberate peeling. This eliminates the source of material flaking that reduces manufacturing yield, while the contact covering portion remains to maintain electrode positioning precision.
Solution Approach 2:
The Pd electrode is segmented into a contact covering portion that maintains positioning precision and an insulating film covering portion that is removed to prevent material flaking. This segmentation resolves the contradiction between maintaining precision and improving yield.
4Reliability
If the insulating film covering portion peels off incompletely and overhangs from the contact covering portion, then the adhesion is partially maintained, but the pad electrode cannot be formed in the desired place, creating voids
Solution Approach 1:
The insulating film covering portion is completely extracted and removed through deliberate peeling, eliminating any overhanging portions that would interfere with pad electrode formation. This ensures precise pad electrode positioning without compromising adhesion where needed.
Solution Approach 2:
The Pd electrode is segmented such that the insulating film covering portion is completely separated and removed, while the contact covering portion remains intact. This complete segmentation prevents overhanging portions and ensures accurate pad electrode formation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances manufacturing yield by preventing voids and direct contact with the p-type contact layer, maintaining device reliability without the additional process step of forming an adhesive layer, thus maintaining the Pd electrode's integrity and reducing manufacturing costs.
Implementation Method 1
peeling and removing the portion of the Pd electrode on the insulating film by the application of physical force to the portion
Data Source
AI summary
A method for manufacturing a semiconductor light emitting device includes forming an insulating film on a semiconductor substrate, the insulating film having an opening therein, forming a Pd electrode in the opening and on the insulating film, and removing the portion of the Pd electrode on the insulating film by the application of a physical force to the portion, while leaving the Pd electrode in the opening.