Peanut-Shaped Semiconductor Contact Structure for Defect Reduction

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Solution Overview

Problem

The combination of butted and square contacts in semiconductor devices leads to challenges during lithograph and etch steps, resulting in frequent defects such as photo bridge and high junction leakage due to differing contact sizes and shapes, which complicates the manufacturing process.

Innovation Solution

A peanut-shaped opening with a conductive plug and diffusion barrier layers is used to create an improved connection structure, allowing for smaller feature sizes and more complex circuits by accommodating varying contact sizes and shapes, and reducing defects through precise filling and patterning techniques.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Quantity of substance

If butted contacts and square contacts are used in combination to increase device density, then device density is improved, but manufacturing defects increase due to different contact sizes and shapes

Engineering Contradiction:

Improvedevice densityVSAvoidcontact formation precision

Core Design Contradiction:

Quantity of substanceVSManufacturing precision

Solution Approach 1:

The contact structure is divided into two distinct segments: a first contact with a bottom surface and a second contact with a top surface, allowing each contact type to be optimized independently for its specific function while maintaining overall device density

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The contacts are arranged in a vertical stacking configuration rather than lateral arrangement, transitioning from two-dimensional planar contacts to three-dimensional stacked contacts, enabling increased device density without compromising manufacturing precision

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Adaptability or versatility

If different contact sizes and shapes are used to accommodate varying circuit requirements, then circuit complexity is improved, but lithograph and etch step challenges increase

Engineering Contradiction:

Improvecontact configuration flexibilityVSAvoidlithograph and etch process complexity

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The stacked contact structure serves multiple functions: providing electrical connection paths, enabling device density increase, and accommodating different contact size requirements, all within a single unified structural approach that simplifies the lithograph and etch processes

Inventive Principle:

Principle #6Universality (Multi-functionality)

Data Source

PatentUS7705464B2Connection structure for semiconductor devices

Publication Date: 2010.04.27 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

The present disclosure relates generally to the manufacturing of semiconductor devices, and more particularly to an improved connection structure for semiconductor devices. A connection structure for a semiconductor device includes: a peanut-shaped opening comprising a narrow area and one or more wide areas, wherein the narrow area is between two of the one or more wide areas; and a conductive plug for filling at least partially the peanut-shaped opening.