Heat Dissipation Member for PECVD Substrate Temperature Control
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Solution Overview
Problem
The challenge in fabricating display devices using glass or plastic substrates is maintaining a low temperature during film deposition to prevent substrate deformation, as these substrates have a low transition temperature, and existing PECVD technologies face issues with uniform temperature distribution and heat dissipation.
Innovation Solution
A deposition apparatus with a heat dissipation member featuring a frame-shaped structure and spacers that enclose the outer side surfaces of the plates, providing efficient heat dissipation and maintaining a uniform temperature distribution by extending along the sidewall portions and being in direct contact with the plates, thereby enhancing the PECVD process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If PECVD technology is used to deposit films at low temperature, then substrate deformation is prevented, but uniform temperature distribution and heat dissipation become problematic
Solution Approach 1:
The heat dissipation member is divided into multiple functional components: a frame-shaped structure with multiple sidewall portions, spacers positioned at intervals, and contact portions. This segmentation allows each component to contribute to overall heat dissipation effectiveness and temperature uniformity across the substrate.
Solution Approach 2:
The heat dissipation structure transitions from a conventional planar design to a three-dimensional frame-shaped configuration with sidewall portions extending vertically. This dimensional change increases the heat dissipation surface area and improves thermal management effectiveness without interfering with the deposition process.
2Loss of energy
If a heat dissipation member is added to improve heat dissipation, then temperature control is enhanced, but device complexity increases
Solution Approach 1:
The heat dissipation member serves multiple functions simultaneously: it provides thermal management through the frame-shaped structure, maintains spacing between components via spacers, and ensures stable positioning through contact portions. This multi-functionality reduces the need for separate components and simplifies the overall apparatus.
Solution Approach 2:
The patent combines the heat dissipation function with the structural support function by integrating spacers and contact portions into a single heat dissipation member. This merging reduces the number of separate components and assembly steps while achieving both thermal management and structural stability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus ensures uniform deposition and increased heat-dissipation efficiency, allowing for the deposition of films at low temperatures without substrate deformation, improving the uniformity and effectiveness of the PECVD process.
Implementation Method 1
a heat dissipation member in contact with the first plate and the second plate
Implementation Method 2
the second plate includes a plurality of diffusion holes provided therein
Implementation Method 3
Plasma-enhanced chemical vapor deposition (PECVD) technology can be used to deposit a semiconductor and dielectric film on a large area even at a relatively low temperature
Implementation Method 4
Plasma-enhanced chemical vapor deposition (PECVD) technology
Data Source
AI summary
A deposition apparatus includes a chamber, a deposition source, and a stage disposed in the chamber with a target object mounted thereon. The deposition apparatus further includes a first plate coupled to the chamber, and a second plate disposed between the first plate and the stage, wherein the second plate includes a plurality of diffusion holes. The deposition apparatus additionally includes a heat dissipation member in contact with the first plate and the second plate, wherein the heat dissipation member includes a plurality of sidewall portions, wherein the plurality of sidewall portions are connected to each other. The deposition apparatus further includes a spacer coupled to a first sidewall portion of the plurality of sidewall portions and disposed between the first plate and the second plate, wherein the spacer extends parallel to the first sidewall portion.