Protective Tape Peeling Angle Control for Wafer Integrity
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Solution Overview
Problem
Existing peeling apparatuses cause cracking of wafers or leave adhesive residue during the peeling process due to changes in the bending angle of protective tapes.
Innovation Solution
A peeling apparatus with a holder table and peeling assembly that includes a gripping unit, horizontal movement assembly, separating assembly, and interior angle setting unit, controlled by a controller to maintain a preset angle during peeling, preventing cracking and adhesive residue.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the protective tape is peeled by relatively moving the gripping unit and holder table in a horizontal direction, then the peeling process can be completed, but the bending angle of the protective tape changes causing the wafer to crack or glue to remain unremoved
Solution Approach 1:
The peeling assembly is designed to dynamically adjust the interior angle of the protective tape during peeling. The gripping unit can change its orientation relative to the holder table, allowing the system to adapt the bending angle in real-time during the peeling process, thereby preventing wafer cracking while ensuring complete glue removal.
Solution Approach 2:
The invention changes the geometric parameter (interior angle) of the protective tape during peeling. By controlling the interior angle to be between 30° and 60° relative to the normal direction of the workpiece surface, the system optimizes the stress distribution on the wafer, preventing cracking while maintaining effective adhesive removal.
2Device complexity
If the protective tape is peeled with changing bending angle, then the peeling motion is simple, but cracking occurs and glue remains on the wafer
Solution Approach 1:
Rather than using a complex multi-axis positioning system, the invention employs a dynamic gripping unit that can rotate or pivot to maintain the optimal interior angle. This dynamic adjustment mechanism adds minimal complexity while significantly improving peeling reliability by preventing wafer damage and ensuring complete adhesive removal.
3Manufacturing precision
If the interior angle of the protective tape is controlled during peeling, then cracking and adhesive residue are prevented, but the peeling apparatus becomes more complex
Solution Approach 1:
The gripping unit is designed with multi-functionality, serving both to grip the protective tape and to control its interior angle during peeling. This integrated design allows one component to perform multiple functions, reducing the overall device complexity while maintaining precise control over the peeling angle and quality.
Solution Approach 2:
The invention merges the gripping function and angle control function into a single peeling assembly. By combining these functions in one integrated unit rather than using separate mechanisms, the system achieves precise interior angle control without proportionally increasing device complexity.
Data Source
AI summary
A peeling apparatus to peel a protective member from a first surface of a plate-formed workpiece includes a holder table having a holder surface to hold a second surface of the workpiece and a peeling assembly to peel the protective member from the workpiece held on the holder table. The peeling assembly includes a gripping unit to grip the protective member, a horizontal movement assembly to move the gripping unit and the holder table relatively in a horizontal direction, a separating assembly to separate the gripping unit gripping the protective member from the holder table, an interior angle setting unit to set an interior angle between the protective member adhered to the first surface of the workpiece and the protective member being peeled, and a controller to maintain the interior angle at an angle set by the interior angle setting unit while the protective member is being peeled.