Peeling Layer for Laser Delamination in Electronic Device Manufacturing
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Solution Overview
Problem
The existing method for manufacturing flexible electronic devices using laser delamination to peel off a glass substrate from a resin layer faces issues such as carbide generation due to laser heat, leading to attachment problems and reduced yield.
Innovation Solution
A method involving the formation of a peeling layer with specific materials like molybdenum, amorphous silicon, or titanium oxide, followed by stacking a resin layer and a barrier layer, and then peeling off the substrate using light irradiation to reduce binding forces and prevent carbide formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If laser delamination is used to peel off the glass substrate from the resin layer, then the glass substrate can be removed, but carbide is generated due to laser heat causing attachment problems and reduced yield
Solution Approach 1:
A peeling layer is introduced as an intermediary between the glass substrate and the resin layer. This peeling layer absorbs the laser energy and enables delamination without direct laser exposure to the resin layer, preventing carbide generation. The peeling layer acts as a mediator that facilitates substrate removal while protecting the resin layer from harmful thermal effects.
Solution Approach 2:
The patent replaces direct laser heating of the resin layer with laser heating of the peeling layer. By substituting the target of laser energy absorption from the resin layer to the peeling layer, the method eliminates carbide generation while maintaining the delamination function. This substitution changes which material undergoes thermal processing.
2Productivity
If laser heat is applied to delaminate the glass substrate, then peeling can be achieved, but carbide attachment occurs reducing manufacturing quality
Solution Approach 1:
The peeling layer serves as an intermediary that absorbs laser energy to enable efficient delamination. By positioning the peeling layer between the laser source and the resin layer, it mediates the energy transfer process, allowing rapid peeling while preventing direct laser-induced carbide formation in the resin layer that would compromise display region visibility.
Solution Approach 2:
The patent changes the material parameters of the interface layer by introducing a peeling layer with specific optical and thermal properties. This peeling layer has high laser absorption capability but does not generate carbide when heated, thereby changing the thermal response parameters of the system to achieve efficient delamination without quality degradation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the yield of electronic device manufacturing by avoiding delamination issues and preventing carbide generation, resulting in improved visibility and reliability of the display regions.
Implementation Method 1
peeling off the resin layer from the motherboard and the peeling layer by irradiating the peeling layer and the resin layer with light
Data Source
AI summary
A method for manufacturing an electronic device includes the following: forming an island-shaped peeling layer onto a substrate; stacking a resin layer all over the peeling layer; forming a barrier layer over the resin layer; forming an electronic-circuit layer onto the upper surface of the barrier layer; and peeling off the resin layer from the substrate and the peeling layer.