Peltier Element Thermal Control for Integrated Circuit Reliability

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Integrated circuits face reduced reliability due to operating temperatures that deviate from their preferred range, necessitating effective heating or cooling solutions.

Innovation Solution

An apparatus utilizing a Peltier element, integrated with a heat sink, controls the temperature of an integrated circuit by reversing the direction of heat flow based on polarity applied to its terminals, maintaining the junction temperature within a preferred range.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If separate heating and cooling apparatus are used to maintain integrated circuit temperature, then temperature control reliability is improved, but device complexity increases

Engineering Contradiction:
Improvetemperature control reliabilityVSAvoiddevice complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent combines separate heating and cooling functions into a single Peltier element that can operate in both heating and cooling modes by reversing the polarity of the applied voltage. This merging of functions reduces the number of components needed while maintaining the ability to control temperature in both directions, thereby reducing device complexity without sacrificing temperature control reliability.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The Peltier element serves multiple functions: it can heat the integrated circuit when voltage is applied in one polarity direction, cool the integrated circuit when voltage polarity is reversed, and can be controlled through a single controller that manages both heating and cooling operations. This multi-functionality eliminates the need for separate heating and cooling apparatus, resolving the contradiction between reliability and complexity.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Device complexity

If a single Peltier element is used for both heating and cooling, then device complexity is reduced, but temperature control precision may worsen

Engineering Contradiction:
Improvedevice complexityVSAvoidtemperature control precision
Core Design Contradiction:
Device complexityVSManufacturing precision

Solution Approach 1:

The patent implements dynamic control of the Peltier element by continuously monitoring the integrated circuit temperature through a sensor and adjusting the voltage polarity and magnitude in real-time. The controller dynamically switches between heating and cooling modes based on temperature feedback, ensuring precise temperature control despite the use of a single multi-functional element. This dynamic adjustment capability maintains temperature control precision while benefiting from reduced device complexity.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The system incorporates a temperature sensor that continuously monitors the integrated circuit temperature and feeds this information back to the controller. The controller uses this feedback to determine when to switch between heating and cooling modes and adjusts the voltage applied to the Peltier element accordingly. This feedback mechanism ensures precise temperature control is maintained even though a single Peltier element performs both heating and cooling functions.

Inventive Principle:
Principle #23Feedback

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution provides a single thermal management system that efficiently maintains the integrated circuit's temperature within its optimal range, enhancing reliability and reducing complexity compared to separate heating and cooling apparatus.

Implementation Method 1

An apparatus and method for controlling a temperature of an integrated circuit which is below or above a preferred temperature range to be within the preferred temperature range using a Peltier element

Methodology Applied
Scientific EffectPeltier effect: Peltier Effect

Data Source

PatentUS20250087554A1Thermal apparatus for an integrated circuit and methods of operation
Publication Date: 2025.03.13 NXP USA INC
  • US20250087554A1 patent drawing
  • US20250087554A1 patent drawing
  • US20250087554A1 patent drawing

AI summary

Apparatus and method for improving reliability of an integrated circuit. The apparatus comprises an integrated circuit and a heatsink which is in contact with package of the integrated circuit. A Peltier element comprises a first surface and a second surface and is positioned in a cavity of the heatsink. Based on a first indication from a sensor, a controller applies a first polarity to a first terminal and second terminal of the Peltier element to reduce a temperature of the second surface to cool the integrated circuit and based on a second indication from the sensor, the controller applies a second polarity to the first terminal and second terminal of the Peltier element to increase the temperature of the second surface to heat the integrated circuit.