Peltier Sensor Package Layout to Block Foreign Matter Transfer
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Solution Overview
Problem
Foreign matters such as dust can adhere to a Peltier element during handling processes and potentially move inside an airtight sealed package, affecting the operation of a sensor element within the package.
Innovation Solution
A sensor apparatus design that includes a package substrate with a Peltier element enclosed in a recess, separated by a ceramic interposer substrate, and sealed with a seal-glass-equipped lid, preventing foreign matter movement and ensuring an airtight environment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the Peltier element is handled during manufacturing and assembly processes, then the Peltier element can be integrated into the package, but foreign matters such as dust may adhere to the Peltier element and move inside the package affecting the sensor element
Solution Approach 1:
A cover member is introduced as an intermediary component between the Peltier element and the sensor element. This cover member physically blocks foreign matters that may detach from the Peltier element during handling, preventing them from reaching and adhering to the sensor element while still allowing the Peltier element to be integrated into the package
Solution Approach 2:
The cover member is positioned and fixed in advance during the packaging process, creating a protective barrier before foreign matters can detach from the Peltier element. This preliminary protective measure ensures that even if foreign matters detach during subsequent handling, they cannot reach the sensor element
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Reduces the adherence of foreign matters to the sensor element, minimizing operational interference and enhancing the reliability and airtightness of the sensor apparatus.
Implementation Method 1
An airtight sealed package incorporating a Peltier element is known as means of cooling a solid-state imaging apparatus
Data Source
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AI summary
Provided is a sensor apparatus that can suppress movement of foreign matter from a Peltier element to a sensor element. The sensor apparatus includes a package substrate, a Peltier element, a circuit substrate, and a sensor element. The package substrate has a recess portion on a side of a first surface and plural terminals on a side of a second surface located on an opposite side of the first surface. The Peltier element is arranged in the recess portion. The circuit substrate is arranged on an opposite side of a bottom surface of the recess portion with the Peltier element sandwiched therebetween. The sensor element is attached to an opposite side of a surface, the surface being opposed to the Peltier element.