Perforated Stiffener Ring Layout for IC Package Connector Reliability
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Solution Overview
Problem
The challenge in the semiconductor industry is the need for smaller and more reliable packaging techniques for semiconductor dies, particularly in reducing the risk of cracking of electrical connectors during manufacturing and operation due to stress and deformation of the package substrate.
Innovation Solution
The integration of a perforated stiffener ring with reduced stiffness and hardness in specific regions to encircle the integrated circuit package component, which reduces the risk of cracking of electrical connectors by alleviating stress concentrations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a traditional stiffener ring with high stiffness and hardness is used, then structural support and rigidity are improved, but the risk of cracking electrical connectors increases due to induced stress
Solution Approach 1:
The stiffener ring incorporates perforated regions with different material properties (reduced stiffness and hardness) at specific locations where electrical connectors are adjacent. This local variation in material quality allows the ring to provide structural support in non-perforated areas while reducing stress concentration and cracking risk in perforated areas near electrical connectors.
Solution Approach 2:
The stiffener ring is segmented into perforated and non-perforated regions, creating distinct zones with different mechanical properties. The perforated regions are strategically positioned to reduce stress on electrical connectors, while maintaining overall structural integrity through the non-perforated portions of the ring.
2Reliability
If the stiffness of the stiffener ring is reduced to prevent connector cracking, then reliability of electrical connectors is improved, but structural support capability deteriorates
Solution Approach 1:
Different regions of the stiffener ring have different stiffness characteristics - perforated regions have reduced stiffness to protect electrical connectors, while non-perforated regions maintain high stiffness for structural support. This spatial variation in material quality resolves the contradiction between overall structural strength and local connector protection.
Solution Approach 2:
The stiffener ring functions as a composite structure combining perforated and non-perforated regions with contrasting mechanical properties. This composite approach allows the ring to simultaneously provide structural support (through non-perforated regions) and reduce stress on connectors (through perforated regions), resolving the contradiction between strength and reliability.
Data Source
AI summary
An integrated circuit package with a perforated stiffener ring and the method of forming the same are provided. The integrated circuit package may comprise an integrated circuit package component having an integrated circuit die on a substrate, an underfill between the integrated circuit package component and the substrate, and a stiffener ring attached to the substrate. The stiffener ring may encircle the integrated circuit package component and the underfill in a top-down view. The stiffener ring may comprise a perforated region, wherein the perforated region may comprise an array of openings extending from a top surface of the stiffener ring to a bottom surface of the stiffener ring.