Array Substrate Sidewall Protection for Peripheral Metal Wires
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Solution Overview
Problem
High-resolution display devices face issues with short circuits and open circuits due to etching solutions damaging metal wires during the manufacturing process, leading to reduced yield rates, especially in active matrix organic light emitting diode (AMOLED) production where acidic etching solutions cause over-etching and defects like short circuits and light/dark spots.
Innovation Solution
A manufacturing method for array substrates involves forming a protective structure on the lateral sides of metal wires in the peripheral region to prevent etching solutions from corroding the metal wires, thereby preventing short circuits and open circuits, and improving product yield. This method includes forming a source-drain metal pattern and a protective structure on the substrate, which contacts and covers the metal wires, blocking the etching solution during subsequent etching processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If etching solution is used to pattern metal layers, then metal wires can be formed with precise patterns, but the etching solution causes over-etching and damages metal wires leading to short circuits and open circuits
Solution Approach 1:
A protective film is formed on the metal wires before the etching process to prevent etching solution from damaging the wires. This preliminary protective action allows subsequent etching to proceed without causing over-etching or wire damage, resolving the contradiction between achieving precise patterns and maintaining wire integrity.
Solution Approach 2:
The protective film acts as an intermediary layer between the etching solution and the metal wires. It selectively protects the wire regions while allowing etching to proceed in non-wire areas, enabling precise pattern formation without direct contact between the etching solution and metal wires.
2Measurement precision
If high-resolution display devices are manufactured with dense pixel arrangements, then display quality improves, but the risk of short circuits and open circuits increases due to closer wire spacing
Solution Approach 1:
The protective film is formed in advance on metal wires before etching, creating a safety margin that becomes increasingly important as wire spacing decreases in high-resolution displays. This preliminary protection ensures that even with closer wire spacing, the etching solution cannot damage adjacent wires, maintaining circuit reliability while enabling higher resolution.
3Productivity
If conventional etching process is used without protective structures, then manufacturing process is simple and fast, but yield rate decreases due to short circuits and open circuits
Solution Approach 1:
The protective film formation step is added before etching to prevent defects. Although this adds a process step, it prevents costly rework and scrap from short circuits and open circuits, ultimately improving yield rate while maintaining reasonable manufacturing efficiency.
Data Source
Figure 1a~1c
Figure 1d~2
Figure 3~4b
AI summary
An array substrate and a manufacturing method thereof, and a display device are provided. The manufacturing method of the array substrate includes forming a source-drain metal pattern (110) on a substrate (101), wherein the substrate (101) includes a display region (1010) and a peripheral region (1012) located around the display region (1010), the source-drain metal pattern (110) located on the peripheral region (1012) including a plurality of metal wires (112); and forming a protective structure (130) on a lateral side of each of the metal wires (112), wherein the protective structure (130) contacts and covers the lateral side of each of the metal wires (112). Thus, the manufacturing method of the array substrate can prevent the etching solution from etching the metal wires, thereby preventing the occurrence of short circuit or open circuit on the array substrate, and then improving the yield rate of the product.