Permeable Electrode Post-Exposure Bake Apparatus
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Solution Overview
Problem
The photolithography process faces challenges in achieving precise and accurate transfer of small features onto substrates due to low throughput, increased line edge roughness, and decreased resist sensitivity, particularly with small wavelength lithography, which affects the resolution and sensitivity of the photoresist layer.
Innovation Solution
The implementation of an electrode assembly with a permeable electrode and an intermediate medium between the photoresist layer and the electrode assembly to apply an electric field, controlling the diffusion of charged species and reducing line edge/width roughness by maintaining a consistent electric field strength, thereby enhancing exposure resolution and sensitivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If small wavelength lithography is used to reduce minimum printable size, then manufacturing precision is improved, but productivity decreases and line edge roughness increases
Solution Approach 1:
An intermediate medium (liquid or gel) is introduced between the electrode assembly and the photoresist layer to replace air. This medium has higher permittivity than air, which concentrates the electric field more effectively within the photoresist layer during post-exposure bake, thereby improving the effectiveness of charged species migration and resolving the trade-off between precision and productivity
Solution Approach 2:
The patent changes the physical parameters of the post-exposure bake process by introducing an intermediate medium with different dielectric properties than air. This parameter change enhances the electric field strength and uniformity, allowing for better control of charged species diffusion while maintaining acceptable processing throughput
2Manufacturing precision
If small wavelength lithography is used to reduce minimum printable size, then manufacturing precision is improved, but line edge roughness increases
Solution Approach 1:
The intermediate medium (liquid or gel) serves as a mediator that enhances electric field uniformity and strength during post-exposure bake. This improved field distribution leads to more uniform migration of charged species, reducing random diffusion effects that cause line edge roughness while maintaining the ability to print small features
Solution Approach 2:
By changing the dielectric environment from air to an intermediate medium with higher permittivity, the electric field parameters are optimized. This results in more controlled charged species migration and reduced line edge roughness, directly addressing the harmful effect while preserving manufacturing precision
3Manufacturing precision
If small wavelength lithography is used to reduce minimum printable size, then manufacturing precision is improved, but resist sensitivity decreases
Solution Approach 1:
The intermediate medium with higher permittivity concentrates the electric field more effectively, enhancing the migration of charged species generated during exposure. This increased field effectiveness compensates for reduced resist sensitivity by ensuring sufficient charged species reach the necessary locations to maintain pattern fidelity
Solution Approach 2:
The dielectric parameters of the post-exposure bake environment are changed by introducing an intermediate medium. This parameter change amplifies the electric field effect on charged species, effectively restoring resist sensitivity despite the use of small wavelength lithography
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach improves the uniformity of the electric field, reduces line edge/width roughness, and increases the sensitivity of the photoresist layer, leading to more accurate and precise feature transfer during the photolithography process.
Implementation Method 1
An electrode assembly may be utilized to generate an electric field to a photoresist layer disposed on the substrate prior to or after an exposure process so as to modify chemical properties of a portion of the photoresist layer
Implementation Method 2
maintaining a consistent electric field strength, thereby enhancing exposure resolution and sensitivity
Data Source
AI summary
A method and apparatus for applying an electric field and/or a magnetic field to a photoresist layer without air gap intervention during photolithography processes is provided herein. The method and apparatus include an electrode assembly and a base assembly. The electrode assembly includes a permeable electrode. The base assembly includes one or more process fluid channels disposed around a circumference of the substrate support surface and configured to fill a process volume with a process fluid. The electrode assembly is configured to apply an electric field to a substrate disposed within the process volume.