Perpendicular Electrode Display Chip Layout to Prevent Pad Shorting
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Solution Overview
Problem
The increasing miniaturization of micro-semiconductor chips and the expansion of display devices pose challenges for the pick and place method, leading to decreased productivity and potential electrical short-circuits when micro-semiconductor chips are omitted, as existing technologies lack effective mechanisms to prevent unintentional contact between electrodes and pads.
Innovation Solution
A display device with a perpendicular electrode structure and a manufacturing method that includes a first pad connected to the first electrode and a second pad connected to the second electrode, where the second electrode is not in contact with the first pad when the micro-semiconductor chip is absent, using a dummy pad and specific pad shapes to prevent short-circuits, and a method of forming pads to ensure non-overlap or recessed configurations to isolate the second electrode from the first pad.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the pick and place method is used to transfer micro-semiconductor chips, then the transfer process can be performed, but productivity decreases due to the miniaturization of chips and expansion of display devices
Solution Approach 1:
The invention segments the electrode structure into multiple isolated components (first electrode, second electrode, first pad, second pad) with deliberate spatial separation. The second electrode is positioned to extend beyond the chip boundary but is prevented from contacting the first pad through geometric design, creating modular, independent electrical connection zones that simplify the transfer process while maintaining high precision requirements.
2Productivity
If micro-semiconductor chips are omitted during transfer, then productivity may be maintained, but electrical short-circuits occur between the second electrode and first pad
Solution Approach 1:
The invention applies preliminary anti-action by pre-configuring the pad and electrode geometry to prevent the harmful effect of short-circuiting. The first pad is designed with a recess portion, and the second electrode is positioned to overlap this recess when the chip is absent, but the recess geometry ensures no electrical contact occurs. This preemptive geometric design eliminates the risk of short-circuits before they can happen during the transfer process.
Solution Approach 2:
The recess portion of the first pad acts as an intermediary structural element that mediates the spatial relationship between the first pad and the second electrode. This recessed geometry serves as a physical buffer zone that allows the second electrode to extend into the area above the first pad without creating electrical contact, thus preventing short-circuits while maintaining design flexibility.
3Ease of operation
If the second electrode is allowed to extend beyond the chip boundary for perpendicular electrode structure, then electrode connectivity is improved, but contact with the first pad causes short-circuits when chip is absent
Solution Approach 1:
The invention applies local quality by creating a specialized recessed geometry in the first pad at the specific location where the second electrode extends. This local structural modification allows the second electrode to maintain its extended position for connectivity purposes while the recessed area provides localized electrical isolation. The solution is applied precisely where needed rather than requiring global redesign of the electrode structure.
Data Source
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AI summary
A display device having a perpendicular electrode structure and a method of manufacturing the display device are provided. The display device includes a display substrate including wiring therein, a first pad provided on the display substrate and connected to the wiring, a second pad provided on the display substrate, spaced apart from the first pad, and connected to the wiring, and a micro-semiconductor chip including a first electrode, a p-type semiconductor layer provided on the first electrode, an active layer provided on the p-type semiconductor layer, an n-type semiconductor layer provided on the active layer, and a second electrode provided on the n-type semiconductor layer, wherein the micro-semiconductor chip is constituted by a perpendicular electrode chip, the first electrode is connected to the first pad, and the second electrode is connected to the second pad.