Perpendicular Heatsink Semiconductor Module for High-Temperature SiC

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Solution Overview

Problem

Conventional semiconductor device modules face challenges in achieving high-temperature operation, downsizing, and weight reduction, particularly with silicon carbide semiconductor elements which require enhanced durability and heat dissipation capabilities.

Innovation Solution

A semiconductor device module design incorporating a circuit board, first and second heatsinks, and main electrode terminals, where the first heatsink is mounted perpendicularly on the second heatsink, and the main electrode terminals are connected to the circuit board and protrude from the first heatsink, allowing for efficient heat dissipation and compact design.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If conventional silicon semiconductor elements are used with traditional heat dissipation arrangements, then heat dissipation is improved, but device size and weight increase significantly

Engineering Contradiction:

Improveheat dissipation capabilityVSAvoiddevice weight

Core Design Contradiction:

TemperatureVSWeight of moving object

Solution Approach 1:

The patent changes the fundamental parameter of semiconductor substrate material from silicon to silicon carbide, which enables operation at higher temperatures (175°C or higher) and allows for reduced heat dissipation requirements, thereby reducing the size and weight of heat dissipation structures

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent transitions from planar heat dissipation arrangement to a three-dimensional stacked configuration where the first heatsink is mounted perpendicularly on the second heatsink, allowing heat dissipation in multiple directions and reducing the horizontal footprint and overall weight

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Temperature

If silicon carbide semiconductor elements are used for high-temperature operation, then operating temperature is improved, but wiring connection durability becomes insufficient

Engineering Contradiction:

Improveoperating temperatureVSAvoidwiring connection durability

Core Design Contradiction:

TemperatureVSReliability

Solution Approach 1:

The patent employs composite material structures in the wiring connections, including copper wires for electrical conductivity, silver paste for bonding, and resin encapsulation for protection, creating a multi-material system that maintains durability at high temperatures

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The patent introduces intermediate connection structures including wire bonds, solder joints, and resin encapsulation as mediators between the silicon carbide semiconductor element and external circuits, ensuring reliable electrical connection while withstanding high-temperature operation

Inventive Principle:

Principle #24Intermediary (Mediator)

3Adaptability or versatility

If more electronic components and wire members are added to increase functionality, then device functionality is improved, but device size increases

Engineering Contradiction:

Improvedevice functionalityVSAvoiddevice size

Core Design Contradiction:

Adaptability or versatilityVSWeight of moving object

Solution Approach 1:

The patent segments the device into modular functional units (semiconductor element, circuit board, heatsinks, wire connections) that can be independently optimized and arranged, allowing high functionality within a compact footprint through efficient spatial organization

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent implements a nested structure where the circuit board is mounted on the first heatsink, which is in turn mounted on the second heatsink, creating a compact stacked arrangement that maximizes component density while minimizing overall device size and weight

Inventive Principle:

Principle #7Nested doll (Nesting)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enables a downsized and weight-reduced semiconductor device module capable of high-temperature operation with improved heat dissipation, ensuring reliability and productivity while maintaining high bonding strength and heat resistance.

Implementation Method 1

The first heatsink has the circuit board mounted thereon... The first heatsink is mounted on the second heatsink such that its main surface extends perpendicularly to a main surface of the second heatsink

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

The main electrode terminal extends in a direction parallel to the main surface of the first heatsink, and has one end thereof connected to the circuit board and the other end thereof protruding from an upper side of the first heatsink

Methodology Applied

Scientific EffectElectrical conduction: Conduction (electrical)

Data Source

PatentUS8610263B2Semiconductor device module

Publication Date: 2013.12.17 MITSUBISHI ELECTRIC CORP

AI summary

A P-side package unit and a N-side package unit are arranged on a main surface of a metal heatsink such that a main surface extends in a direction perpendicular to the main surface of the heatsink. Each of the P-side package unit and the N-side package unit is fixed by an end edge portion of a heatsink being clipped by a rail-shaped unit mounting part provided on the main surface of the heatsink.