Perpendicular MLCC Layout to Eliminate Capacitive Howling

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Solution Overview

Problem

The piezoelectric effect of MLCCs in electronic devices causes deformation and collision with the PCB, leading to audible 'capacitive howling' and deformation of the circuit board, affecting device performance and reliability.

Innovation Solution

The MLCC capacitors are designed with ceramic medium layers and inner electrodes perpendicular to the circuit board surface, aligning their deformation direction parallel to the board, preventing collisions and 'capacitive howling', and allowing direct mounting for efficient space use.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If the MLCC is mounted with ceramic medium layers parallel to the circuit board, then the MLCC can be easily mounted and connected, but the MLCC deforms vertically and collides with the circuit board causing capacitive howling

Engineering Contradiction:
Improvemounting easeVSAvoidcapacitive howling
Core Design Contradiction:
Ease of operationVSObject-generated harmful factors

Solution Approach 1:

The patent changes the mounting orientation from parallel to perpendicular. The ceramic medium layers are disposed perpendicular to the circuit board, so deformation occurs horizontally along the board surface rather than vertically toward it. This dimensional change eliminates collision while maintaining electrical connection through laterally extending outer electrodes.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Reliability

If the MLCC deforms vertically during operation, then the piezoelectric effect functions normally, but the MLCC collides with the circuit board causing vibration and noise

Engineering Contradiction:
Improvepiezoelectric functionVSAvoidboard vibration
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent redirects the deformation direction from vertical to horizontal by perpendicular mounting. The piezoelectric effect still causes deformation, but it now occurs laterally along the circuit board surface rather than vertically toward it, eliminating mechanical collision and associated vibration and noise.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent creates an asymmetric mounting configuration where the MLCC is oriented perpendicular to the circuit board rather than parallel. This asymmetric orientation ensures that the deformation direction is always parallel to the board surface, preventing symmetric collision patterns that cause capacitive howling.

Inventive Principle:
Principle #4Asymmetry

3Volume of moving object

If the MLCC is directly mounted on the circuit board, then space efficiency is improved, but mounting precision must be maintained to ensure reliability

Engineering Contradiction:
Improvespace occupationVSAvoidmounting precision
Core Design Contradiction:
Volume of moving objectVSManufacturing precision

Solution Approach 1:

The patent changes the mounting dimension from parallel to perpendicular orientation. This allows the outer electrodes to extend laterally along the circuit board surface, providing larger bonding areas and more forgiving alignment tolerances, thereby reducing the impact of mounting precision requirements while maintaining space efficiency.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design improves device performance by eliminating 'capacitive howling', ensuring circuit board stability, and enhancing reliability and space efficiency.

Implementation Method 1

Because of a piezoelectric effect of an MLCC, when a voltage applied to the MLCC changes, the MLCC deforms

Methodology Applied
Scientific EffectPiezoelectric effect: Piezoelectric Effect

Data Source

PatentEP4648074A1MLCC and manufacturing method therefor, and circuit board assembly and electronic device
Publication Date: 2025.11.12 HONOR DEVICE CO LTD
  • EP4648074A1 patent drawingFigure 1~2
  • EP4648074A1 patent drawingFigure 3~5
  • EP4648074A1 patent drawingFigure 6~7

AI summary

This application provides an MLCC capacitor, a method for manufacturing an MLCC capacitor, a circuit board assembly, and an electronic device. An MLCC capacitor makes each ceramic medium layer and each inner electrode in a ceramic body perpendicular to a board surface of a circuit board, so that a deformation direction of the MLCC capacitor is parallel to the board surface of the circuit board, the MLCC capacitor does not collide with the circuit board, and a phenomenon of ""capacitive howling" does not occur. This can improve a use effect of an electronic device, and can especially improve use experience of the electronic device in a radio frequency transmission and reception process (for example, a call process). In addition, the circuit board does not deform, so that stability of the circuit board during long-term use can be ensured, and reliability and a service life of the circuit board can be improved. In addition, the MLCC capacitor is directly mounted on the circuit board, which occupies small space. This is beneficial to space layout of the circuit board, and can also ensure mounting precision of the MLCC capacitor, and improve reliability of the MLCC capacitor.