Phase-Change Cooling for Semiconductor Heat Dissipation
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Solution Overview
Problem
Conventional liquid-cooled configurations for power electronics systems are costly and complex due to the need for external pumps and radiators, limiting their effectiveness in managing the high heat flux generated by power semiconductor devices.
Innovation Solution
An electronic assembly utilizing a phase-change cooling system with evaporator stacks and condensation containers that convert liquid coolant into vapor and back to liquid without a pump, leveraging the natural flow of refrigerant to dissipate heat from semiconductor devices through a two-phase thermal interface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If liquid-cooled configurations are used to manage high heat flux from power semiconductor devices, then heat dissipation capability is improved, but system cost and complexity increase due to external pumps and radiators
Solution Approach 1:
The invention extracts and eliminates the pump and radiator components from the liquid cooling system. Instead of using active pumping and external radiators, the system uses passive capillary wick structures to transport coolant and dissipate heat, thereby maintaining effective heat dissipation while significantly reducing system complexity
Solution Approach 2:
The cooling system is designed to be self-regulating through capillary action. The wick structures automatically draw coolant from the evaporator to the condenser without external pumps, and the phase change process itself drives the coolant circulation, making the system self-service and eliminating complex control mechanisms
2Temperature
If liquid-cooled configurations are used to manage high heat flux from power semiconductor devices, then heat dissipation capability is improved, but manufacturing cost increases
Solution Approach 1:
The invention replaces expensive active cooling components (pumps, radiators, controls) with simpler, cheaper passive components (capillary wicks, phase change materials). The evaporator and condenser structures use readily available materials and simpler manufacturing processes, reducing overall system cost while maintaining heat dissipation effectiveness
3Device complexity
If air cooling is used for power semiconductor devices, then system simplicity is improved, but heat extraction capability becomes insufficient for high heat flux
Solution Approach 1:
The invention utilizes phase transitions (evaporation and condensation) of the coolant to dramatically enhance heat extraction capability. The evaporator absorbs heat by converting liquid coolant to vapor, and the condenser releases heat by condensing vapor back to liquid, providing high heat flux removal while maintaining relative system simplicity
Solution Approach 2:
The system employs fluid dynamics principles through capillary action to transport coolant without pumps. The wick structures create pressure gradients that drive coolant flow from the evaporator through the condenser and back, achieving effective heat extraction with simpler components than conventional liquid cooling
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution provides a cost-effective, pump-free, and efficient heat management system that effectively dissipates thermal energy from semiconductor devices, enhancing the longevity and reliability of power electronics systems by spreading heat over a large area for efficient air-cooled dissipation.
Implementation Method 1
the evaporator stack or its heated floor can convert a liquid-phase of a coolant into a gas-phase of the coolant
Implementation Method 2
the evaporator stack overlies the first side of the semiconductor device, wherein the evaporator stack or its heated floor can convert a liquid-phase of a coolant into a gas-phase of the coolant
Implementation Method 3
the condensation container adapted to receive a gas-phase or vapor-phase of a coolant and to cool or convert the received gas-phase of the coolant into a liquid phase
Implementation Method 4
the condensation container adapted to receive a gas-phase or vapor-phase of a coolant and to cool or convert the received gas-phase of the coolant into a liquid phase
Implementation Method 5
An electronic assembly utilizing a phase-change cooling system with evaporator stacks and condensation containers that convert liquid coolant into vapor and back to liquid without a pump
Data Source
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AI summary
An electronic assembly (111) comprises a heat-conducting feature (21) that has a first side (22) and a second side (24) opposite the first side. An evaporator stack (26) has a floor (28) and a hollow body (42). The evaporator stack overlies the heat-conducting feature. The heated floor can convert a liquid-phase of a coolant (e.g., refrigerant) into a gas-phase of the coolant. A condensation container (36) is in communication with the evaporator stack and is arranged to receive a gas-phase of the coolant. The condensation container is configured to convert the received gas-phase of the coolant into a liquid phase to replenish the liquid-phase coolant for interaction with the floor of the evaporator stack.