Phenol Resin Composition with Calcium Carbonate for Plating Adhesion

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Solution Overview

Problem

Existing technologies do not effectively improve adhesion between a resin molded body and a plating film when a plating process is applied to the resin surface.

Innovation Solution

A phenol resin composition comprising phenol resin and calcium carbonate, which includes specific ratios and types of resol-type and novolac-type phenol resins, along with calcium carbonate particles of certain sizes, to enhance adhesion and mechanical strength, and optionally includes elastomers and fillers for improved stability and strength.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If conventional resin compositions are used for molded bodies, then the molding process is simple, but the adhesion between the resin molded body and plating film is insufficient

Engineering Contradiction:
Improveadhesion between resin molded body and plating filmVSAvoidresin composition complexity
Core Design Contradiction:
StrengthVSDevice complexity

Solution Approach 1:

The patent uses a composite resin composition comprising phenol resin and polyamide resin in specific ratios (phenol resin 70-90 parts by mass, polyamide resin 10-30 parts by mass). This composite material approach combines the adhesion-promoting properties of phenol resin with the mechanical strength and chemical resistance of polyamide resin, achieving superior plating adhesion without excessive complexity in the resin formulation.

Inventive Principle:
Principle #40Composite materials

2Strength

If phenol resin composition is used to improve adhesion, then adhesion to plating film improves, but mechanical strength and temperature cycling reliability need to be maintained

Engineering Contradiction:
Improveadhesion to plating filmVSAvoidtemperature cycling reliability
Core Design Contradiction:
StrengthVSReliability

Solution Approach 1:

The patent optimizes the ratio of phenol resin to polyamide resin within specific ranges (phenol resin 70-90 parts, polyamide resin 10-30 parts) to balance adhesion and thermal stability. Additionally, the patent specifies the phenol resin molecular weight (150-500) and polyamide resin molecular weight (200-1000) to control the physical properties, ensuring the material maintains mechanical strength and temperature cycling reliability while achieving improved plating adhesion.

Inventive Principle:
Principle #35Parameter changes

Data Source

PatentUS12435216B2Phenol resin composition
Publication Date: 2025.10.07 SUMITOMO BAKELITE CO LTD
  • US12435216B2 patent drawing
  • US12435216B2 patent drawing
  • US12435216B2 patent drawing

AI summary

A phenol resin composition used in a resin molded body for which a plating process is applied to a surface includes component (A), which is phenol resin and component (B), which is calcium carbonate.