Phenyl-Containing Silicone Encapsulant for LED Thermal Stability
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Solution Overview
Problem
Curable silicone compositions used in light emitting devices often suffer from poor mechanical and adhesion properties, leading to issues like delamination and fracture, which affect the reliability and performance of the devices, especially under thermal and light exposure.
Innovation Solution
A composition comprising alkenyl functional, phenyl-containing polyorganosiloxanes, Si-H functional phenyl-containing polyorganosiloxanes, and a hydrosilylation catalyst, which, when cured, forms silicone products with improved optical clarity, high refractive index, and mechanical strength, enhancing the reliability of light emitting devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If optically clear silicone compositions are used in light emitting devices, then thermal and light resistance is improved, but mechanical strength and adhesion properties deteriorate
Solution Approach 1:
The patent applies composite materials by combining multiple silicone components with different functions: a base silicone composition providing optical clarity and thermal resistance, and a silicone resin component providing mechanical strength and adhesion. This composite approach allows the final encapsulant to simultaneously achieve both optical performance and mechanical reliability without compromising either property.
2Strength
If conventional epoxy resin materials are used, then mechanical strength is improved, but thermal and light resistance deteriorates due to discoloration
Solution Approach 1:
The patent changes the chemical composition parameters by using phenyl-containing polyorganosiloxane structures instead of conventional epoxy resin. The phenyl groups provide inherent thermal and light stability, preventing discoloration while maintaining mechanical strength. This parameter change in molecular structure allows the material to resist degradation from heat and light exposure that would cause epoxy resin to discolor and fail.
3Strength
If silicone resin is used as a toughening agent, then mechanical properties are improved, but optical clarity may deteriorate
Solution Approach 1:
The patent applies local quality by carefully selecting and formulating the silicone resin component to have specific properties that provide mechanical enhancement while maintaining optical compatibility. The resin is designed with appropriate molecular weight, functional groups, and crosslinking characteristics that allow it to reinforce the base composition without creating light scattering or yellowing, thus achieving localized mechanical improvement without compromising overall optical clarity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides light emitting devices with enhanced mechanical strength and adhesion properties, preventing delamination and fracture, and maintaining optical clarity and reliability under thermal and light exposure conditions.
Implementation Method 1
hydrosilylation-curable compositions that cure to form silicone products
Data Source
Figure 1
AI summary
A composition includes: (I) an alkenyl functional, phenyl-containing polyorganosiloxane, an Si-H functional phenyl-containing polyorganosiloxane, or a combination thereof; (II) a hydrogendiorganosiloxy terminated oligodiphenylsiloxane having specific molecular weight, an alkenyl-functional, diorganosiloxy-terminated oligodiphenylsiloxane having specific molecular weight, or a combination thereof; and (III) a hydrosilylation catalyst. A light emitting device is made by applying the composition onto a light source followed by curing. The composition provides a cured material with mechanical properties suited for use as an encapsulant for a light emitting device.