Phosphor-Coated LED Dies via Pre-Dicing Array Coating
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Solution Overview
Problem
Conventional methods for applying photoconversion materials to LEDs are inefficient and costly, with significant waste generated from the use of carrier substrates during the LED dicing process, limiting the throughput and effectiveness of phosphor coating at the die level.
Innovation Solution
A method involving the application of a phosphor film around LED dies on a submount or substrate before dicing, allowing for efficient coating and reuse of the substrate, thereby reducing waste and enhancing throughput by applying the phosphor material collectively before individual processing of LED chips.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If phosphor material is applied to each LED die individually using conventional methods, then the coating can be precisely applied, but the throughput is low and the cost is high
Solution Approach 1:
The patent merges multiple LED dies onto a single carrier substrate and applies phosphor coating to the entire array simultaneously, rather than coating each die individually. This combining approach maintains coating precision while dramatically increasing throughput by processing multiple dies in parallel.
Solution Approach 2:
The patent performs preliminary actions by first mounting multiple LED dies onto a carrier substrate in an array configuration, then applying the phosphor coating to the entire array at once. This preliminary arrangement enables efficient batch processing while maintaining individual die coating quality.
2Ease of operation
If a carrier substrate is used to support LED dies during dicing, then the dies can be handled easily, but the carrier substrate is wasted and cannot be reused
Solution Approach 1:
The patent applies phosphor coating to LED dies mounted on a carrier substrate before the dicing process. The carrier substrate is then discarded after serving its purpose of holding multiple dies during coating and dicing operations. This approach recovers the value of the carrier substrate by enabling efficient batch processing while accepting its temporary use and subsequent disposal.
Solution Approach 2:
The patent segments the manufacturing process into distinct stages: mounting multiple dies on a carrier substrate, applying phosphor coating to the entire array, and then dicing to separate individual coated dies. This segmentation allows the carrier substrate to serve its function efficiently during critical processing steps before being discarded.
3Manufacturing precision
If phosphor coating is performed after LED dicing, then each die can be coated individually, but the process is time-consuming and costly
Solution Approach 1:
The patent performs phosphor coating as a preliminary action before the dicing process, while multiple LED dies are still mounted together on a carrier substrate. This preliminary coating approach significantly reduces processing time by coating multiple dies simultaneously, while the subsequent dicing process maintains individual die coating accuracy.
Solution Approach 2:
The patent merges multiple LED dies into a single coated unit by applying phosphor coating to the entire array before dicing. This merging approach enables simultaneous coating of multiple dies, dramatically reducing total processing time while the subsequent separation process maintains individual coating quality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables efficient phosphor coating at the die level, reducing material waste and improving photoconversion efficiency while allowing for the reuse of substrates, thus lowering costs and enhancing the LED packaging process.
Implementation Method 1
a photoconversion material such as phosphor may be utilized to change the light output from one color to another
Data Source
AI summary
The present disclosure involves lighting apparatus. The lighting apparatus includes a first doped semiconductor layer. A light-emitting layer is disposed over the first doped semiconductor layer. A second doped semiconductor layer is disposed over the light-emitting layer. The second doped semiconductor layer has a different type of conductivity than the first doped semiconductor layer. A photo-conversion layer is disposed over the second doped semiconductor layer and over side surfaces of the first and second doped semiconductor layers and the light-emitting layer. The photo-conversion layer has an angular profile.