Photochemical Release Layer for Low Warpage Advanced Packaging
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Solution Overview
Problem
Current methods for removing electronic packages from glass carriers require mechanical force, leading to potential deformation and defects due to the use of chemically bonded adhesion layers, which compromises the integrity of silicon chips and interconnects, and reduces yield in multi-chip packaging architectures.
Innovation Solution
A release layer comprising molecules with release moieties that absorb electromagnetic radiation at specific frequencies, allowing for non-mechanical separation of the electronic package from the carrier through a chemical reaction, thereby reducing the need for excessive mechanical force and minimizing damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a chemically bonded adhesion layer is used to attach the package to the carrier, then strong adhesion is achieved, but mechanical force is required for separation causing warpage and defects
Solution Approach 1:
The patent replaces the mechanical separation process with a photochemical separation process. The release layer contains photolabile groups that undergo chemical bond breaking when exposed to light, eliminating the need for mechanical force that causes warpage and defects. This substitution transforms the separation mechanism from mechanical to photochemical, resolving the contradiction between strong adhesion and mechanical damage.
Solution Approach 2:
The patent changes the chemical parameters of the adhesion layer by incorporating photolabile functional groups that can transition from a bonded state to a separated state through light-induced chemical reactions. This parameter change allows the adhesion strength to be dynamically controlled - strong under normal conditions but easily reversible with light exposure, thereby eliminating mechanical damage during separation.
2Ease of operation
If mechanical force is applied to separate the package from the carrier, then separation is achieved, but deformation and warpage occur
Solution Approach 1:
The patent replaces mechanical separation with photochemical separation using photolabile groups in the release layer. When exposed to light, these groups undergo bond breaking reactions that cleanly separate the package from the carrier without applying mechanical force, thereby maintaining package flatness and eliminating warpage while still achieving easy separation.
Solution Approach 2:
The patent incorporates photolabile functional groups into the release layer during manufacturing, preparing the system in advance for clean separation. This preliminary chemical preparation ensures that when light is applied, separation occurs uniformly and cleanly without the need for mechanical force that would cause deformation, thus preserving manufacturing precision.
3Strength
If a chemically bonded release layer is used, then secure adhesion is achieved, but yield is reduced due to defects
Solution Approach 1:
The patent replaces mechanical separation with photochemical separation, eliminating the defects and damage that occur during mechanical force application. This substitution maintains secure adhesion through the chemically bonded release layer while preventing yield-reducing defects, thereby improving manufacturing yield without sacrificing adhesion strength.
4Object-affected harmful factors
If electromagnetic radiation is used to modify the release layer, then non-mechanical separation is achieved, but frequency control is required
Solution Approach 1:
The patent uses electromagnetic radiation to trigger photochemical reactions in photolabile groups within the release layer, replacing mechanical separation entirely. This approach eliminates mechanical damage while the frequency control requirement is a standard characteristic of electromagnetic radiation systems, representing an acceptable trade-off for achieving damage-free separation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables secure adhesion and subsequent non-destructive release of the package, reducing warpage and defects, and allowing for improved yield and customization of release characteristics to suit various frequency bands and materials, thus addressing the limitations of mechanical separation methods.
Implementation Method 1
The release moiety is a moiety that preferentially absorbs electromagnetic radiation at a selected frequency band and chemically reacts to sever the monolayer
Data Source
AI summary
Embodiments disclosed herein include electronic packages and methods of forming such packages. In an embodiment, the electronic package comprises a package substrate having a first surface and a second surface opposite from the first surface, and a monolayer having a plurality of first molecules over the first surface of the package substrate. In an embodiment, the first molecules each comprise a first functional group attached to the first surface, and a first release moiety attached to the first functional group.