Photodiode Electrode Layout With Shared Photomask Patterning
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Solution Overview
Problem
The increasing number of layers in electronic devices leads to higher manufacturing costs, necessitating a method to reduce these expenses without compromising performance.
Innovation Solution
The electronic device design includes a substrate, a first electrode layer, a photodiode, an insulating layer, a second electrode layer, and a first transparent conductive layer, where the electrode layers and transparent conductive layers are formed using a shared photomask process to minimize the number of manufacturing steps and costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If separate photomasks are used for forming electrode layers and transparent conductive layers, then each layer can be precisely patterned, but the number of photomasks and manufacturing processes increases
Solution Approach 1:
The patent combines the formation of the electrode layer and transparent conductive layer into a single photomask process. The photomask includes both an electrode layer pattern and a transparent conductive layer pattern, allowing both layers to be formed simultaneously in one exposure and development step, thereby reducing the total number of photomasks and manufacturing processes while maintaining the precision of both patterns
Solution Approach 2:
The photomask is designed to serve multiple functions: it patterns both the electrode layer and the transparent conductive layer, and also defines the opening regions where the insulating layer is removed. This multi-functional photomask eliminates the need for separate photomasks for each layer, reducing manufacturing complexity while maintaining pattern precision
2Reliability
If multiple separate manufacturing processes are used for different layers, then each layer can be optimized independently, but the overall manufacturing cost increases
Solution Approach 1:
The patent merges the manufacturing processes for the electrode layer and transparent conductive layer into a single integrated process using one photomask. This reduces the number of exposure, development, and etching cycles required, thereby lowering manufacturing costs while still allowing independent optimization of each layer's material composition and thickness parameters
3Adaptability or versatility
If the number of layers is increased to improve device functionality, then device performance is enhanced, but manufacturing costs increase
Solution Approach 1:
The photomask is designed with multi-functionality to pattern multiple layers (electrode layer and transparent conductive layer) and define multiple features (conductive regions and opening regions) in a single exposure step. This approach allows the device to maintain enhanced functionality with multiple layers while reducing the cumulative cost impact of additional manufacturing processes
Data Source
AI summary
An electronic device including a substrate, a first electrode layer, a photodiode, an insulating layer, a second electrode layer, and a first transparent conductive layer is provided. The first electrode layer is disposed on the substrate. The photodiode is disposed on the first electrode layer and is electrically connected to the first electrode layer. The insulating layer is disposed on the photodiode. The second electrode layer is disposed on the insulating layer and is electrically connected to the photodiode. The first transparent conductive layer is disposed on the insulating layer and contacts the second electrode layer. A manufacturing method of an electronic device is also provided.