Photoelectric Conversion Module Horizontal Waveguide Alignment

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Solution Overview

Problem

Conventional photoelectric conversion modules suffer from decreased optical coupling efficiency due to the vertical alignment of optical devices and waveguides, leading to light loss and increased manufacturing complexity, with additional components like micro mirrors and lenses complicating the process and increasing costs.

Innovation Solution

A photoelectric conversion module design where the optical device and waveguide are aligned horizontally, with electrode pads and bumps facilitating efficient optical coupling, reducing the need for additional components and simplifying the manufacturing process, allowing for independent replacement of electric and optical circuit devices.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If optical devices are positioned vertically aligned with waveguides, then electrical connection is achieved, but optical coupling efficiency decreases

Engineering Contradiction:
Improveelectrical connectionVSAvoidoptical coupling efficiency
Core Design Contradiction:
ReliabilityVSLoss of energy

Solution Approach 1:

The patent transitions from vertical alignment to horizontal alignment of optical devices with waveguides, changing the spatial dimension of coupling. This dimensional change allows the optical active surface of VCSELs to be directly coupled with the optical waveguide end face, improving optical coupling efficiency while maintaining electrical connection through separate bonding pads

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Loss of energy

If additional components like micro mirrors and lenses are added, then optical coupling efficiency is improved, but device complexity increases

Engineering Contradiction:
Improveoptical coupling efficiencyVSAvoidnumber of components
Core Design Contradiction:
Loss of energyVSDevice complexity

Solution Approach 1:

The patent extracts and eliminates unnecessary intermediate components (micro mirrors and lenses) from the optical path. By directly coupling the VCSEL optical active surface with the waveguide end face through horizontal alignment, the system achieves efficient optical coupling without requiring these additional components, thereby simplifying the device structure

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent merges the optical coupling function directly at the interface between VCSEL and waveguide by eliminating intermediate components. The horizontal alignment enables direct optical coupling, combining the functions of optical emission, coupling, and transmission into a more integrated and simplified structure

Inventive Principle:
Principle #5Merging (Combining)

3Loss of energy

If additional components are added to improve optical coupling, then optical coupling efficiency is improved, but manufacturing cost increases

Engineering Contradiction:
Improveoptical coupling efficiencyVSAvoidmanufacturing cost
Core Design Contradiction:
Loss of energyVSEase of manufacture

Solution Approach 1:

The patent removes additional optical components (micro mirrors and lenses) that increase manufacturing cost. The horizontal alignment configuration enables direct coupling between VCSEL and waveguide, eliminating the need for these expensive components and their associated alignment and bonding processes

Inventive Principle:
Principle #2Taking out (Extraction)

4Reliability

If vertical alignment is used, then electrical connection is achieved, but light loss increases

Engineering Contradiction:
Improveelectrical connectionVSAvoidlight loss
Core Design Contradiction:
ReliabilityVSLoss of substance

Solution Approach 1:

The patent changes the alignment dimension from vertical to horizontal, allowing the optical active surface of VCSELs to be directly coupled with the optical waveguide end face. This horizontal configuration minimizes light loss by enabling direct optical coupling without the need for light reflection or complex optical paths

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design enhances optical coupling efficiency, reduces light loss, simplifies repairs by allowing independent replacement of circuit units, and decreases manufacturing costs through reduced component complexity and easier alignment of optical devices with waveguides.

Implementation Method 1

a photoelectric conversion device of a sender converts an electric signal into an optical signal

Methodology Applied
Scientific EffectPhotoelectric conversion: Photoelectric Effect

Implementation Method 2

the converted optical signal is transmitted to a receiver by an optical fiber or an optical waveguide

Methodology Applied
Scientific EffectTotal internal reflection: Total Internal Reflection

Data Source

PatentUS8705906B2Photoelectric conversion module
Publication Date: 2014.04.22 KOREA ELECTRONICS TECH INST
  • US8705906B2 patent drawing
  • US8705906B2 patent drawing
  • US8705906B2 patent drawing

AI summary

There is provided a photoelectric conversion module in which an optical device and an optical waveguide are arrayed in a horizontal direction, thereby improving the optical coupling efficiency and therefore, reducing light loss. To this end, the present invention provides a photoelectric conversion module comprising: a printed circuit board; an integrated circuit board mounted on the printed circuit board, wherein an optical waveguide array is positioned within the integrated circuit board so as to pass from one side to the other side of the integrated circuit board, and first and second electrode pads are positioned at one sidewall of the integrated circuit board; an optical device array wherein first and second electrode bumps to be respectively connected to the first and second electrode pads are positioned at one sidewall of the optical device array facing the integrated circuit board and an optical device is positioned in a middle part of the optical device array; and a semiconductor chip mounted on the is integrated circuit board.