Stacked Photoelectric Sensor Wiring for Brightness and Event Pixels
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Solution Overview
Problem
Existing photoelectric conversion devices lack effective forms of electrical paths that distinguish between pixels generating signals corresponding to light brightness and those generating event signals, limiting their performance and functionality.
Innovation Solution
The photoelectric conversion device incorporates a first and second semiconductor component with distinct wiring structures and insulating films, featuring recessed portions for metal portions, allowing for separate electrical paths for brightness and event signal pixels, with varying conductor sizes and configurations to optimize signal transmission and processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If separate electrical paths are implemented for brightness pixels and event signal pixels, then signal processing efficiency and reading speed are improved, but device structure and wiring complexity increase
Solution Approach 1:
The patent divides the pixel array into two distinct types: first pixels for brightness signal generation and second pixels for event signal generation. Each pixel type has dedicated electrical paths leading to separate conductor portions, which then connect to different wiring structures. This segmentation allows independent optimization of signal reading paths, improving processing efficiency while maintaining manageable complexity through systematic organization.
Solution Approach 2:
The patent utilizes vertical stacking of semiconductor components with multi-layer wiring structures. Conductor portions are formed in recessed regions of insulating films at different vertical levels, creating three-dimensional electrical paths. This vertical dimensionality allows separate electrical paths to be routed through different layers and spatial regions, reducing planar congestion and managing wiring complexity while maintaining high-speed signal transmission.
2Reliability
If different conductor sizes are used for first and second electrical paths, then signal transmission optimization is achieved, but manufacturing precision requirements increase
Solution Approach 1:
The patent implements conductor portions with different sizes and configurations tailored to specific signal path requirements. The first conductor portion connected to brightness pixels has dimensions optimized for high-volume analog signal collection, while the second conductor portion for event pixels has dimensions optimized for low-volume digital signal transmission. This local customization of conductor quality allows each path to be optimized for its specific function while maintaining manufacturability through standardized fabrication processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables high-speed reading of event detection signals and efficient signal processing, reducing power consumption and improving the device's ability to capture images with increased resolution and frame rate.
Implementation Method 1
the first metal portion and the second metal portion are bonded to each other at the bonding surface
Implementation Method 2
The first insulating film and the second insulating film are bonded to each other at a bonding surface
Implementation Method 3
a photoelectric conversion element is provided and a circuit board that is bonded to the light receiving substrate and includes an address event detection circuit configured to detect a change in voltage output from the photoelectric conversion element
Data Source
AI summary
A photoelectric conversion device includes first and second semiconductor components. A semiconductor layer of the first semiconductor component includes a pixel array unit. First and second elements are included in a semiconductor layer different from the first semiconductor layer. At a bonding surface, first and second insulating films are bonded, and first and second metal portions are bonded. A first pixel generating a signal corresponding to brightness and the first element are connected through the first metal portion. A second pixel generating an event signal and the second element are connected through a second metal portion. A first conductor included in a first electrical path and positioned in a predetermined layer between first and fourth surfaces is provided, and a second conductor included in a second electrical path and positioned in the predetermined layer is provided. The first and second conductors are different in size.