Photoelectric Composite Substrate Position Accuracy
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing photoelectric composite substrates face challenges in achieving high accuracy for mounting optical and electronic components due to limitations in position accuracy of opening portions.
Innovation Solution
A photoelectric composite substrate design featuring a wiring substrate with a first region for an optical waveguide and a second region for wiring, including a core layer, cladding layers, and an insulating layer with openings to expose the wiring layer, where the insulating layer is made of the same material as the core layer, allowing for precise positioning of components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If strict position accuracy is required for mounting optical and electronic components, then component mounting precision is improved, but manufacturing complexity increases
Solution Approach 1:
The patent merges the core layer and insulating layer into a single integrated structure made of the same material. This integration eliminates the need for separate processing steps and alignment procedures for two different layers, thereby achieving high position accuracy for opening portions without significantly increasing manufacturing complexity
Solution Approach 2:
The insulating layer is designed to serve multiple functions: it provides electrical insulation for the wiring layer, forms the opening portions for component mounting, and integrates with the core layer structure. This multi-functionality reduces the number of separate components needed, simplifying the overall substrate structure while maintaining high positioning accuracy
2Productivity
If optical and electronic components are mounted on one substrate, then integration density is improved, but positioning accuracy of opening portions deteriorates
Solution Approach 1:
By combining the core layer and insulating layer into one unified structure made of the same material, the patent enables simultaneous formation of optical waveguide features and electrical opening portions through a single processing step. This merging approach maintains high position accuracy even as integration density increases
Solution Approach 2:
The patent applies different local functions within the unified core-insulating layer structure: the first region contains the optical waveguide with its specific refractive index profile, while the second region contains the wiring layer with insulating openings. This local differentiation allows high integration density while maintaining precise positioning for both optical and electronic components
Data Source
AI summary
There is provided a photoelectric composite substrate including: a wiring substrate comprising a first region and a second region; an optical waveguide disposed on the first region of the wiring substrate and including: a first cladding layer on the wiring substrate; a core layer on the first cladding layer; a second cladding layer on the core layer; a wiring layer on the second region of the wiring substrate; and an insulating layer having an opening portion on the wiring layer such that the wiring layer is exposed through the opening portion, wherein the insulating layer is made of the same material as that of the core layer.