Photoelectric Conversion Substrate Wire Layout for Ghosting Suppression
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Solution Overview
Problem
Existing electronic components suffer from ghosting phenomena due to light reflection by conductive wires, which can cause image distortion and reduce image quality.
Innovation Solution
The conductive wires are designed with specific bends and angles to minimize light reflection, keeping them within a certain distance and angle range from the electrode surface, and incorporating optical members with antireflection coatings to redirect light back towards the conductive wires, reducing ghosting occurrences.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If the conductive wire is arranged straight and close to the electrode surface, then the manufacturing is simple and the structure is compact, but light is reflected by the conductive wire and enters the optical imaging surface causing ghosting
Solution Approach 1:
The conductive wire is configured with a bent shape including at least one bent portion instead of a straight arrangement. This curvature causes incident light to be reflected away from the optical imaging surface, preventing ghosting while maintaining a compact structure within the housing.
Solution Approach 2:
The conductive wire extends in multiple directions and heights rather than a single plane. By positioning the wire at different heights above the electrode surface and arranging it to extend in various directions, the design redirects light reflections away from the optical path while maintaining manufacturing feasibility.
2Object-affected harmful factors
If the conductive wire is bent to suppress ghosting, then light reflection is reduced, but the wire arrangement becomes more complex and harder to manufacture
Solution Approach 1:
The conductive wire incorporates bent portions with controlled angles (30° or more relative to the electrode surface normal). This standardized curvature approach effectively redirects light while maintaining compatibility with conventional wire bonding processes, balancing manufacturing ease with ghosting suppression.
Solution Approach 2:
The design specifies particular geometric parameters for the conductive wire including bent portion angles of 30° or more and height constraints (wire height ≤ 1/4 of the distance between optical member and photoelectric conversion substrate). These parameter specifications enable effective ghosting suppression while maintaining manufacturability through controlled variations rather than complex arbitrary shapes.
3Object-affected harmful factors
If the conductive wire is positioned higher to reduce reflection to the optical surface, then ghosting is suppressed, but the component size increases
Solution Approach 1:
The conductive wire is positioned at controlled heights above the electrode surface (height ≤ 1/4 of the distance between optical member and photoelectric conversion substrate) and arranged to extend in multiple directions. This three-dimensional arrangement redirects light reflections away from the optical imaging surface without requiring excessive vertical space, maintaining compact component dimensions.
Solution Approach 2:
The bent configuration of the conductive wire allows it to achieve effective light redirection at lower heights compared to a straight wire arrangement. The curvature enables the wire to redirect light away from the optical path within a compact volume, suppressing ghosting without increasing overall component size.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively suppresses ghosting by ensuring light is reflected closer to the conductive wires, maintaining image quality and potentially reducing the component's size.
Implementation Method 1
a first portion, arranged on the photoelectric conversion substrate, of the conductive wire includes at least one bent portion... a portion, from the first electrode to a first height, of the first portion has a maximum angle not larger than 30° with respect to the normal direction
Data Source
AI summary
An electronic component including a support substrate and a photoelectric conversion substrate is provided. The photoelectric conversion substrate includes a photoelectric conversion region and a peripheral region in which a first electrode is arranged. The first electrode is connected to a second electrode arranged on the support substrate via a wire. A first portion, arranged on the photoelectric conversion substrate, of the wire includes at least one bent portion, the wire is arranged within a range of not more than 200 μm from a surface of the first electrode, and a portion, from the first electrode to a first height, of the first portion has a maximum angle not larger than 30° with respect to a normal direction of the surface where the first height is ½ of a maximum height of the wire from the surface.