Photon Counting Detector Tile Layout for Cable-Free Bias Distribution
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Solution Overview
Problem
Existing photon counting detectors face challenges in creating large area detectors due to the difficulty in distributing high voltage bias across tiles without interfering with the sensor performance and X-ray spectrum, especially in conventional X-ray CT systems using direct conversion sensor materials like CdTe, CZT, and Silicon.
Innovation Solution
A modular photon counting detector system where each tile has a high voltage electrode or foil with tail sections that make electrical connections with adjacent tiles, allowing for a daisy-chain distribution of bias voltage, eliminating the need for cables and maintaining sensor performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If cables are used to distribute high voltage to each tile, then high voltage bias can be provided to the sensor, but it requires soldering which impacts serviceability and interferes with the impinging X-ray spectrum
Solution Approach 1:
The high voltage distribution system is segmented into modular tiles, each with its own high voltage electrode and tail section. This eliminates the need for continuous cables running across the detector, improving serviceability while maintaining electrical connection.
Solution Approach 2:
The harmful cables are extracted from the system and replaced with integrated high voltage electrodes that are part of the tile structure itself. This removes the source of X-ray interference and soldering requirements while preserving the essential high voltage bias function.
2Use of energy by moving object
If cables are used to distribute high voltage, then high voltage bias can be provided to the sensor, but it interferes with the impinging X-ray spectrum
Solution Approach 1:
The harmful cables that interfere with the X-ray spectrum are completely removed from the detection path. Instead, high voltage is delivered through thin electrodes that are integrated into the tile structure and do not interfere with incoming X-rays.
Solution Approach 2:
The high voltage distribution is localized to each tile through integrated electrodes rather than using extensive cabling. This localizes the electrical connection points and eliminates the need for cables that would traverse the X-ray detection area and cause spectral interference.
3Use of energy by moving object
If routing high voltage along the sides of the detector is done, then high voltage can be distributed, but it has a detrimental impact on the sensor performance
Solution Approach 1:
Instead of routing high voltage along the sides (one-dimensional approach), the patent uses tail sections that extend from the high voltage electrode through the tile structure. This moves the connection path to a different spatial dimension, avoiding interference with the sensor active area while maintaining electrical connection.
4Reliability
If soldering is used to connect high voltage cables to tiles, then electrical connection is achieved, but it impacts serviceability
Solution Approach 1:
The electrical connection system is segmented into modular components with integrated high voltage electrodes on each tile. This eliminates the need for soldering operations during assembly or repair, as connections are made through mechanical interfaces between tile tail sections.
Solution Approach 2:
The soldering process is extracted from the system by using integrated high voltage electrodes that connect through mechanical means rather than permanent soldered joints. This improves serviceability while maintaining reliable electrical connection for high voltage bias.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the creation of large area photon counting detectors with efficient high voltage bias distribution, allowing for easy maintenance and replacement of tiles, while minimizing interference with the X-ray spectrum and maintaining stringent alignment requirements.
Implementation Method 1
a sensor material layer; an integrated circuit;... the integrated circuit is configured to readout signals from a plurality of pixels of the sensor material layer
Implementation Method 2
These sensor materials are semiconductor compounds which require a high voltage bias (e.g. 300V/mm) to ensure a homogeneous electric field within the bulk
Implementation Method 3
an anti scatter grid... positioned adjacent to a surface of the sensor material layer
Data Source
AI summary
The present invention relates to a photon counting detector comprising a plurality of detector tiles. Each detector tile comprises a sensor material layer (20), an integrated circuit (30), an input/output connection or flex (50), a high voltage electrode or foil (60), and an anti scatter grid (10). The input/output connection or flex is connected to the integrated circuit. The integrated circuit is configured to readout signals from the sensor material layer. The anti scatter grid is positioned adjacent to a surface of the sensor material layer. The high voltage electrode or foil extends across the surface of the sensor material layer and is configured to provide a bias voltage to the surface of the sensor material layer. The high voltage electrode or foil comprises at least one tail section (70). Relating to the photon counting detector and the plurality of detector tiles, the high voltage electrode or foil of a first detector tile is configured to make an electrical connection with the high voltage electrode or foil of an adjacent detector tile via one or more tail sections of the at least one tail section of the first detector tile and/or via one or more tail sections of the at least one tail section of the adjacent detector tile.