Photon Counting Detector Tile Layout for Cable-Free HV Biasing
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Solution Overview
Problem
Existing photon counting detectors face challenges in creating large area detectors due to the need for high voltage biasing, which is difficult to distribute effectively without interfering with the X-ray spectrum and impacting sensor performance when using cables or routing along the sides.
Innovation Solution
A photon counting detector system utilizing a daisy-chain connection method with high voltage foil extensions and tail sections to propagate bias voltage across detector tiles, avoiding the need for cables and minimizing interference with the X-ray spectrum.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If cables are used to distribute high voltage to detector tiles, then high voltage can be supplied to each tile, but the cables interfere with the impinging X-ray spectrum and impact sensor performance
Solution Approach 1:
The harmful cables are extracted and replaced by a conductive layer that is integrated into the detector structure. The high voltage distribution function is separated from the X-ray detection path, allowing HV supply without spectral interference.
Solution Approach 2:
A conductive layer acts as an intermediary between the high voltage source and the detector tiles. This layer distributes HV electrically while being transparent to X-rays, mediating between the conflicting requirements of HV supply and X-ray transparency.
2Object-affected harmful factors
If high voltage is routed along the sides of the detector, then cable interference is reduced, but sensor performance is still detrimentally impacted
Solution Approach 1:
The high voltage distribution is moved from a lateral routing approach (along the sides) to a planar integration approach (conductive layer on the detection surface). This dimensional reorganization allows HV distribution without compromising the sensor's X-ray detection performance.
3Area of stationary object
If detector tiles are assembled into large area detectors, then detection area is extended, but serviceability is reduced due to required soldering
Solution Approach 1:
The detector is segmented into modular tiles that can be independently assembled and serviced. The conductive layer integration enables electrical connections without permanent soldering, allowing tiles to be replaced or repaired without affecting the entire detector assembly.
4Reliability
If interconnect structures have sufficient thickness to provide electrical connection, then electrical conductivity is improved, but radiation attenuation increases
Solution Approach 1:
The electrical and optical properties of the conductive layer are optimized by adjusting its thickness and material composition. This parameter optimization allows the layer to provide sufficient electrical conductivity for high voltage distribution while maintaining X-ray transparency to minimize radiation attenuation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the creation of large area photon counting detectors with efficient high voltage distribution, maintaining sensor performance and serviceability by eliminating the need for cables and reducing radiation attenuation.
Implementation Method 1
sensor material layer (20) for converting incident photons into electrical charges
Implementation Method 2
These sensor materials are semiconductor compounds which require a high voltage bias (e.g. 300V/mm) to ensure a homogeneous electric field within the bulk
Data Source
Figure 1~2
Figure 3~4
Figure 5~6E
AI summary
The present invention relates to a photon counting detector comprising a plurality of detector tiles. Each detector tile comprises a sensor material layer (20), an integrated circuit (30), an input/output connection or flex (50), a high voltage electrode or foil (60), and an anti scatter grid (10). The input/output connection or flex is connected to the integrated circuit. The integrated circuit is configured to readout signals from the sensor material layer. The anti scatter grid is positioned adjacent to a surface of the sensor material layer. The high voltage electrode or foil extends across the surface of the sensor material layer and is configured to provide a bias voltage to the surface of the sensor material layer. The high voltage electrode or foil comprises at least one tail section (70). Relating to the photon counting detector and the plurality of detector tiles, the high voltage electrode or foil of a first detector tile is configured to make an electrical connection with the high voltage electrode or foil of an adjacent detector tile via one or more tail sections of the at least one tail section of the first detector tile and/or via one or more tail sections of the at least one tail section of the adjacent detector tile.