Photonic Chip Package Layout for Efficient Grating Coupler Alignment
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Solution Overview
Problem
The challenge of integrating photonic integrated circuits with electronic integrated circuits in semiconductor packages to enhance data transmission efficiency while maintaining a compact form factor has not been adequately addressed, particularly in environments with high data traffic demands.
Innovation Solution
A chip structure and semiconductor package design incorporating a photonic integrated circuit chip with a grating coupler, an electronic integrated circuit chip, and an optical block featuring a micro lens and insulating layer, along with an interposer substrate that electrically connects these components and includes a grating coupler overlapping the micro lens, enhancing optical signal conversion and transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If photonic integrated circuits and electronic integrated circuits are integrated in semiconductor packages, then data transmission efficiency is enhanced, but device complexity increases
Solution Approach 1:
The patent merges photonic integrated circuits (PICs) and electronic integrated circuits (EICs) into a single semiconductor package, allowing optical and electrical functions to coexist and interact. This integration enables high-speed data transmission by combining the advantages of optical communication (high bandwidth) with electronic processing (versatility), thereby enhancing productivity while managing complexity through unified package design
Solution Approach 2:
The semiconductor package is designed to perform multiple functions simultaneously: optical signal transmission via PICs, electrical signal processing via EICs, and interconnection between the two through grating couplers. This multi-functionality allows the package to handle both data transmission and processing tasks, improving overall system productivity without requiring separate discrete components
2Reliability
If optical block is added to enhance optical signal coupling, then optical signal coupling efficiency is improved, but manufacturing precision requirements increase
Solution Approach 1:
The grating coupler acts as an intermediary component between the optical block (containing microlenses) and the photonic integrated circuit. It facilitates efficient optical signal coupling by transitioning light from the microlenses to the waveguides on the PIC, thereby improving optical signal coupling efficiency while managing the precision requirements through its intermediate positioning and optical field transformation capabilities
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design improves optical signal coupling efficiency and reduces light scattering, enabling high-performance optical engines within compact semiconductor packages suitable for high-data traffic environments.
Implementation Method 1
an optical block on the photonic integrated circuit chip and spaced apart from the electronic integrated circuit chip in a horizontal direction, the optical block including a micro lens which is convex toward the photonic integrated circuit chip in a vertical direction
Implementation Method 2
a photonic integrated circuit chip including a grating coupler
Data Source
AI summary
Provided is a chip structure, including a photonic integrated circuit chip including a grating coupler, an electronic integrated circuit chip on the photonic integrated circuit chip, an optical block on the photonic integrated circuit chip and spaced apart from the electronic integrated circuit chip in a horizontal direction, the optical block including a micro lens which is convex toward the photonic integrated circuit chip in a vertical direction, and an insulating layer on the electronic integrated circuit chip, the optical block, and the photonic integrated circuit chip, wherein the micro lens overlaps the grating coupler in the vertical direction.