Photonic Component Housing With Monolithic Window Shielding Noise
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Solution Overview
Problem
Semiconductor photonic components face challenges in maintaining accuracy and functionality due to environmental exposure and interference from adjacent circuitry, which existing sealing measures fail to adequately address.
Innovation Solution
An assembly housing with a photonic window element integrated into the housing wall part, providing higher transmissivity than the surrounding housing material, minimizes environmental exposure and interference by controlling critical angles and using light-blocking dopes to prevent stray noise, thus enhancing the sealing and performance of semiconductor photonic components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If sealing components or gaskets are used to protect photonic components from the environment, then protection against environmental hazards is improved, but functionality and accuracy of the photonic component deteriorate due to interference and unwanted noise from adjacent circuitry
Solution Approach 1:
The housing wall part is designed with spatially varying transmissivity: the photonic window element has high transmissivity to allow light transmission for photonic component functionality, while the surrounding housing wall material has low transmissivity to block stray light and electromagnetic interference from adjacent circuitry. This local differentiation of optical properties resolves the contradiction by allowing environmental protection without compromising measurement accuracy.
Solution Approach 2:
The housing wall part combines materials with different transmissivity properties in a single integrated structure. The photonic window element uses highly transmissive material while the surrounding housing wall uses light-blocking material, creating a composite structure that simultaneously provides environmental sealing and electromagnetic shielding to maintain photonic component accuracy.
2Object-affected harmful factors
If additional sealing measures are implemented to improve environmental protection, then sealing effectiveness is improved, but device complexity increases
Solution Approach 1:
The housing wall part merges multiple functions into a single integrated component: environmental sealing, electromagnetic shielding, and optical transmission. The photonic window element with its high transmissivity region and surrounding low transmissivity housing wall material provides all these functions simultaneously, eliminating the need for separate sealing components, gaskets, and shielding elements, thus reducing device complexity while maintaining sealing effectiveness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively shields semiconductor photonic components from environmental hazards and adjacent circuitry noise, maintaining their accuracy and functionality without the need for additional sealing measures, while allowing controlled light transmission for optimal performance.
Implementation Method 1
said at least one photonic window element being a bottom wall of a recess in said exterior surface and forming a monolithic part with the housing wall part and having a transmissivity being larger than the transmissivity of the housing wall part
Data Source
AI summary
The invention relates to an assembly (10) for a semiconductor photonic component (31, 32), wherein the semiconductor photonic component (31, 32) is accommodated in an assembly housing (11) being shielded from the environment. Furthermore, the invention relates to an assembly housing (11) for use with such assembly for a semiconductor photonic component (31, 32). Accordingly, the assembly (10) at least comprising a substrate (30); at least one semiconductor photonic component (31, 32) mounted to the substrate (30), said at least one semiconductor photonic component (31, 32) including a photonic active surface element (31A, 32A); an assembly housing (11) for shielding the substrate (30) and the at least one semiconductor photonic component (31, 32) from the environment; the assembly housing (11) comprises a housing wall part (20, 20) provided with at least one photonic window element (21) facing the photonic active surface element (31A, 32A) of the at least one semiconductor photonic component (31), said at least one photonic window element (21) forming a monolithic part with the housing wall part (20, 20′) and having a transmissivity being larger than the transmissivity of the housing wall part (20, 20′).