Photonic Electronic Package Layout to Prevent Encapsulation Damage
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Traditional copper data channels suffer from signal attenuation and crosstalk due to electromagnetic radiation, and pluggable devices in optical communication systems are limited by performance and require large numbers, leading to increased transmission delay and power consumption, especially at high data rates.
Innovation Solution
An electronic package structure with a carrier, bridge, and encapsulation layer, where the photonic element is placed after encapsulation to prevent contamination and damage, using existing semiconductor processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the photonic element is disposed before forming the encapsulation layer, then the manufacturing process is simpler, but the light transmitters and light receivers of the photonic element are covered by the encapsulation layer causing contamination or damage
Solution Approach 1:
The patent applies preliminary action by forming a through-hole in the encapsulation layer before placing the photonic element. This allows the photonic element to be positioned after encapsulation without requiring modification of the encapsulation process itself, thus maintaining manufacturing simplicity while protecting the photonic element from contamination and damage.
2Ease of operation
If pluggable devices are used for optical communication, then photoelectric conversion can be achieved, but the number of pluggable devices required is large leading to increased transmission delay and power consumption
Solution Approach 1:
The patent merges the optical communication function directly into the package structure by integrating the photonic element with the carrier and electronic elements. This eliminates the need for separate pluggable devices, reducing the number of components, transmission delay, and power consumption while maintaining photoelectric conversion capability.
Data Source
AI summary
An electronic package and a manufacturing method thereof are provided. The electronic package includes a carrier structure, an electronic element, a bridge element, an encapsulation layer, and a photonic element. The electronic element and the bridge element are disposed on a second surface of the carrier structure to be electrically connected to the carrier structure. The encapsulation layer covers the electronic element and the bridge element. The photonic element is disposed on a surface of the encapsulation layer and is electrically connected to the bridge element. In the electronic package and the manufacturing method thereof, the photonic element is disposed after the formation and grinding of the encapsulation layer are completed, the photonic element can be prevented from covering by the encapsulation, thereby contamination or damage to the light transmitters and the light receivers of the photonic element can be avoided.