Photonic Semiconductor Package With Lens-Coupled Optical Interface
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Solution Overview
Problem
As data networks scale to meet increasing bandwidth requirements, copper data channels face limitations due to signal attenuation and crosstalk from radiated electromagnetic energy, which existing techniques like equalization, coding, and shielding struggle to adequately address without significant power and complexity penalties.
Innovation Solution
The development of a semiconductor package that integrates a photonic die with an optical coupler, an encapsulated electronic die, a substrate for mechanical strength, and a lens structure to focus light beams, enabling efficient optical coupling and reducing light beam decadence or divergence.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If copper data channels are used to meet bandwidth requirements, then data transmission capability is improved, but signal attenuation and crosstalk increase significantly
Solution Approach 1:
The patent replaces copper-based electrical signal transmission with optical signal transmission using photonic devices. Light beams transmit data through optical waveguides, eliminating electromagnetic interference and signal attenuation issues inherent in copper channels, thereby maintaining high data transmission capability while significantly improving signal quality
Solution Approach 2:
The patent changes the fundamental transmission medium parameter from electrical conductors (copper) to optical waveguides. This parameter change enables transmission at optical frequencies, providing both high bandwidth capability and immunity to electromagnetic crosstalk, simultaneously addressing both data transmission speed and signal quality requirements
2Reliability
If equalization, coding, and shielding techniques are applied to copper channels, then signal quality is improved, but power consumption and device complexity increase
Solution Approach 1:
The patent eliminates the need for complex signal processing techniques by replacing the transmission medium itself. Optical transmission inherently provides immunity to electromagnetic interference, removing the requirement for equalization circuits, error correction coding, and shielding structures, thereby improving signal quality while reducing system complexity
Solution Approach 2:
The patent extracts and removes the problematic copper transmission medium and its associated corrective measures from the system. By eliminating copper channels entirely, the patent removes the need for power-consuming equalization and coding techniques, achieving both simplified complexity and improved signal quality
3Reliability
If shielding techniques are applied to copper channels, then crosstalk is reduced, but cable bulk and device complexity increase
Solution Approach 1:
The patent replaces electrical transmission with optical transmission, eliminating the need for shielding structures entirely. Optical waveguides naturally confine light signals without requiring metallic shields, achieving crosstalk reduction while dramatically reducing cable bulk and improving space efficiency
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively mitigates the limitations of copper data channels by enabling efficient optical communication with reduced signal attenuation and crosstalk, while also simplifying manufacturing processes compared to contemporary optical communication systems.
Implementation Method 1
a lens structure, configured to focus light beams from the optical signal source
Data Source
AI summary
A manufacturing method of a semiconductor package includes the following steps. A photonic die is provided, wherein the photonic die includes an optical coupler. An electronic die is bonded over the photonic die. An encapsulating material is provided over the photonic die, wherein the encapsulating material at least laterally encapsulates the electronic die. A substrate is bonded over the encapsulated electronic die. A lens structure is formed over the photonic die, wherein the lens structure is overlapped with the optical coupler from a top view.