Photonic Package Waveguide Layout for Lower Optical Loss
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Solution Overview
Problem
Current photonic semiconductor devices face challenges in reducing optical loss and improving communication efficiency due to the use of edge-mounted optical fibers and the need for efficient integration of optical and electrical components.
Innovation Solution
The development of a photonic package that includes waveguides formed on a substrate with a portion replaced by dielectric material, such as silicon oxide, which reduces optical loss and enhances thermal management, allowing for improved optical communication and high-speed data transfer by integrating photonic and electrical components effectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If edge-mounted optical fibers are used for optical signal transmission, then optical communication is enabled, but optical loss increases and communication efficiency decreases
Solution Approach 1:
The patent extracts the optical fiber mounting location from the edge of the substrate and relocates it to the center region. This is achieved by forming a through-hole in the center of the substrate, removing material to create a cavity, and mounting the optical fiber within this central cavity rather than at the substrate edge, thereby reducing optical loss and improving communication efficiency
Solution Approach 2:
The patent performs preliminary actions by pre-forming the through-hole and cavity structure in the substrate before mounting the optical fiber. The cavity is prepared with appropriate dimensions and positioning, and the substrate is pre-processed to include mounting features, so that when the optical fiber is installed, it is already in the optimal central location for minimal optical loss
2Adaptability or versatility
If optical and electrical components are integrated in a photonic package, then full-fledged applications are enabled, but device complexity increases
Solution Approach 1:
The patent merges optical and electrical components into a single photonic package structure. The substrate serves as a common platform that accommodates both optical elements (optical fiber, waveguides) and electrical components (electronic die, conductive elements), integrating their functions while maintaining a unified package design that reduces overall system complexity
Solution Approach 2:
The substrate is designed to perform multiple functions simultaneously: it provides mechanical support, enables optical signal transmission through the through-hole and waveguides, facilitates electrical connections through conductive elements, and offers thermal management. This multi-functional substrate reduces the need for separate components and simplifies the overall package structure
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution reduces optical loss, improves communication efficiency, and enhances thermal management, enabling faster and more reliable optical signal transmission between photonic packages and optical fibers.
Implementation Method 1
waveguides formed on a substrate with a portion replaced by dielectric material
Implementation Method 2
enhances thermal management
Data Source
AI summary
A method includes forming a first photonic package, wherein forming the first photonic package includes patterning a silicon layer to form a first waveguide, wherein the silicon layer is on an oxide layer, and wherein the oxide layer is on a substrate; forming vias extending into the substrate; forming a first redistribution structure over the first waveguide and the vias, wherein the first redistribution structure is electrically connected to the vias; connecting a first semiconductor device to the first redistribution structure; removing a first portion of the substrate to form a first recess, wherein the first recess exposes the oxide layer; and filling the first recess with a first dielectric material to form a first dielectric region.