Photonic Neural Net PIC Bonding for Optical-Electrical Signal Processing
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Solution Overview
Problem
Existing technologies face challenges in integrating optical and electrical components efficiently for signal transmission and processing, particularly in devices that require both long-range optical and short-range electrical signal conversion and processing.
Innovation Solution
The development of a photonic integrated circuit (PIC) using silicon-on-insulator substrates with optical components and metallization layers for electrical connections, incorporating photonic neural networks and convolution modules for high-speed optical signal modulation and processing, utilizing various manufacturing processes such as photolithography and deposition to form optical waveguides, modulators, and heaters for refractive index adjustment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If optical and electrical components are integrated in separate packages, then each component can be optimized independently, but the overall device size increases and signal conversion efficiency decreases
Solution Approach 1:
The patent merges optical components (photonic die) and electrical components (electronic die) into a single integrated package, enabling direct optical-to-electrical signal conversion without external interfacing. This integration improves signal processing efficiency by eliminating intermediate conversion steps while managing the complexity through standardized bonding processes and shared substrate structures.
2Length of moving object
If optical fiber is used for long-range transmission, then signal transmission distance increases, but conversion to electrical signals for short-range processing adds device complexity
Solution Approach 1:
The integrated package serves multiple functions: it handles both long-range optical signal reception via fiber coupling and short-range electrical signal processing through integrated electronic circuits. The photonic die and electronic die are designed to work together as a universal interface that manages both transmission ranges within a single device, reducing the need for separate conversion components.
3Ease of manufacture
If multiple separate devices are used for optical signal conversion and processing, then each device can be simpler in design, but the overall system size and interconnection requirements increase
Solution Approach 1:
The patent employs a nested structure where the electronic die is bonded to the photonic die, with both components mounted on a common substrate. This nesting approach allows each component to maintain its optimized design for ease of manufacture while the integrated package minimizes the total footprint by eliminating the need for separate mounting areas and interconnection structures that would be required for discrete devices.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient integration of optical and electrical components for high-speed signal processing and modulation, facilitating advanced computational operations like convolutional computations in memory architectures.
Implementation Method 1
The convolution module comprises a phase modulator based on a PN junction
Implementation Method 2
utilizing various manufacturing processes such as photolithography and deposition to form optical waveguides, modulators, and heaters for refractive index adjustment
Implementation Method 3
forming a photonic integrated circuit, the photonic integrated circuit comprising a photonic neural network
Data Source
AI summary
Optical devices and methods of manufacture are presented in which a photonic neural net with convolution units is formed within a photonic integrated circuit. The photonic integrated circuit is bonded to a first semiconductor device such as a memory device and is electrically connected to a second semiconductor device such as a system-on-chip device.