Photonic Quantum Processor Chip With Separated Qubit and SPAD Detection

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Solution Overview

Problem

Current quantum computers are large, power-hungry, and require cryogenic systems, limiting their scalability and integration with standard silicon technology for qubit control and data processing.

Innovation Solution

A quantum computing device integrating an electronic integrated circuit (IC) chip with a photonic integrated circuit (PIC) and qubits, allowing operation at higher cryogenic or room temperature, using silicon technology and optical sensors like single-photon avalanche diodes (SPADs), with optical waveguides for radiation transfer and optical switches for switching.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If quantum computers use deep cryogenic cooling systems, then quantum operations can be performed, but the device size and power consumption increase significantly

Engineering Contradiction:
Improvequantum operation stabilityVSAvoiddevice size
Core Design Contradiction:
ReliabilityVSWeight of stationary object

Solution Approach 1:

The system is divided into two separate chips: a first chip containing qubits and a second chip containing optical sensors and control electronics. This segmentation allows the qubits to operate at cryogenic temperatures while the sensors and electronics can operate at higher temperatures, reducing the overall cryogenic cooling burden and device size.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Optical waveguides serve as intermediaries to transfer quantum states and optical radiation between the qubits on the first chip and the optical sensors on the second chip. This intermediary mechanism enables communication between components operating at different temperatures without requiring all components to be cooled to the same extreme temperature.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Reliability

If quantum computers use deep cryogenic cooling systems, then quantum operations can be performed, but power consumption increases significantly

Engineering Contradiction:
Improvequantum operation stabilityVSAvoidpower consumption
Core Design Contradiction:
ReliabilityVSUse of energy by moving object

Solution Approach 1:

By separating the quantum components (qubits) from the detection and control components (optical sensors and electronics) onto different chips, the system only needs to cool the qubits to cryogenic temperatures, while the sensors and electronics can operate at higher, more energy-efficient temperatures, significantly reducing overall power consumption.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The optical sensors and control electronics are extracted from the cryogenic environment and placed on a separate chip that operates at higher temperatures. This extraction eliminates the need to consume energy to cool these components to extreme temperatures, reducing the total power budget of the quantum computer.

Inventive Principle:
Principle #2Taking out (Extraction)

3Reliability

If quantum computers use deep cryogenic cooling systems, then quantum operations can be performed, but scalability to higher number of qubits is limited

Engineering Contradiction:
Improvequantum operation stabilityVSAvoidscalability
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The modular architecture with separate qubit chip and sensor chip allows for independent scaling of each component. Additional qubits can be added to the first chip or additional sensors to the second chip without requiring the entire system to be redesigned, facilitating easier scaling to higher numbers of qubits.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The optical waveguide network and control electronics on the second chip can serve multiple qubits simultaneously, creating a universal interface that can handle various quantum operations across different qubit configurations, thereby simplifying the path to scaling.

Inventive Principle:
Principle #6Universality (Multi-functionality)

4Reliability

If standard silicon technology is not used for qubit control, then quantum operations can be performed with current hardware, but integration with standard silicon technology is limited

Engineering Contradiction:
Improvequantum operation stabilityVSAvoidintegration capability
Core Design Contradiction:
ReliabilityVSAdaptability or versatility

Solution Approach 1:

Optical waveguides act as intermediaries that bridge the quantum domain (qubits) and the classical silicon technology domain (optical sensors and electronics). This intermediary approach allows standard silicon-based photonic components to interface with quantum components, enabling integration with standard silicon technology while maintaining quantum operation stability.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The system operates at temperatures above 77 Kelvin, which is a parameter change from the extreme cryogenic temperatures required by previous systems. This temperature parameter change enables the use of standard silicon technology for optical components and electronics, significantly improving adaptability and integration capability.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables compact, low-power, and scalable quantum computing by enabling standard silicon technology integration and separating qubits from detectors, facilitating higher temperature operation and efficient photon detection.

Implementation Method 1

The optical waveguides are configured to output the optical radiation to the optical sensors by evanescent wave coupling

Methodology Applied
Scientific EffectEvanescent wave coupling: Total Internal Reflection

Implementation Method 2

an anti-reflective (AR) coating disposed between the waveguides and the IC chip and configured to cause leakage of the optical radiation from the waveguides to the optical sensors

Methodology Applied
Scientific EffectLeakage of optical radiation: Total Internal Reflection

Implementation Method 3

the waveguides include spiral waveguides disposed over the optical sensors so as to enhance leakage of the optical radiation to the optical sensors

Methodology Applied
Scientific EffectEvanescent wave coupling enhancement: Total Internal Reflection

Implementation Method 4

the PIC includes turning mirrors at the outputs of the waveguides to reflect the optical radiation toward the optical sensors

Methodology Applied
Scientific EffectReflection: Reflection

Implementation Method 5

the first array of optical sensors includes avalanche detectors, such as single-photon avalanche diodes (SPADs)

Methodology Applied
Scientific EffectAvalanche breakdown: Avalanche Breakdown

Data Source

PatentUS20250299077A1Quantum processor on a chip
Publication Date: 2025.09.25 QUANTUM TRANSISTORS TECH LTD
  • US20250299077A1 patent drawing
  • US20250299077A1 patent drawing
  • US20250299077A1 patent drawing

AI summary

A quantum computing device includes an electronic integrated circuit (IC) chip. The IC chip includes a first array of optical sensors and a photonic integrated circuit (PIC) disposed on the electronic IC chip. The PIC includes a network of optical waveguides, which have respective inputs coupled to receive optical radiation and outputs coupled to deliver the optical radiation to the optical sensors. The IC chip further includes a second array of qubits disposed on the PIC and configured to perform quantum operations and responsively to results of the quantum operations, to output the optical radiation into the inputs of the optical waveguides.