Photonic Component Reinforcement for Stable FAU Optical Alignment
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Solution Overview
Problem
The challenge in electronic devices with fiber array units (FAU) adjacent to photonic ICs is improving optical alignment and reliability due to the need for precise coupling and the vulnerability of thin photonic components to warpage and deformation.
Innovation Solution
Incorporating reinforcement elements and connectors to support photonic components, reducing warpage and enhancing structural strength, and using a recessed substrate design to accommodate connectors, thereby stabilizing optical alignment and improving device reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the connector is disposed under the photonic component to support the optical element, then the structural support and optical coupling are improved, but the photonic component is susceptible to warpage and deformation
Solution Approach 1:
The patent applies local quality by placing reinforcement elements at specific locations on the photonic component - specifically on regions that are not vertically overlapping the substrate. This targeted reinforcement provides localized structural support exactly where needed to prevent warpage, rather than uniformly strengthening the entire component.
Solution Approach 2:
The patent employs composite materials by combining the photonic component with reinforcement elements made of different materials having complementary properties. The reinforcement elements provide mechanical strength while the photonic component maintains its optical properties, creating a composite structure that achieves both structural support and optical functionality.
2Volume of moving object
If the photonic component is made thin to reduce device size, then the device compactness is improved, but the photonic component becomes more vulnerable to deformation
Solution Approach 1:
The patent applies segmentation by dividing the structural support function into two parts: the thin photonic component maintains optical functionality while the separate reinforcement elements provide mechanical strength. This segmentation allows each component to be optimized for its specific function without compromising the other.
Solution Approach 2:
The reinforcement elements act as intermediaries between the thin photonic component and the substrate. These intermediary elements provide the necessary mechanical support to the fragile thin photonic component, enabling it to maintain its thin profile while resisting deformation forces.
3Ease of operation
If the connector is disposed under the photonic component, then the optical coupling configuration is improved, but the alignment precision deteriorates due to warpage
Solution Approach 1:
The patent applies preliminary action by pre-installing the reinforcement elements on the photonic component before disposing the connector underneath. This preliminary reinforcement prevents warpage from developing during subsequent assembly steps, ensuring that the optical alignment precision is maintained throughout the assembly process and operation.
Data Source
AI summary
An electronic device is provided. The electronic device includes a photonic component, a connector, and a first reinforcement element. The photonic component is configured to optically couple to an optical element. The connector is disposed under the photonic component and configured to support the optical element. The first reinforcement element is disposed over the photonic component and configured to allow the photonic component to withstand a force generated by disposing the connector under the photonic component.