Photonic Semiconductor Package Interconnect Signal Conversion
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Solution Overview
Problem
Current technologies face challenges in integrating optical and electrical signaling and processing effectively, particularly in forming high-speed transmission interfaces between optical and electrical components, leading to inefficiencies in signal conversion and processing.
Innovation Solution
The development of three-dimensional (3D) packages that incorporate both optical and electrical devices, utilizing an interposer structure with embedded interconnect devices and a composite material, allowing for improved high-speed transmission of electrical signals and efficient optical-electrical signal conversion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If optical and electrical components are integrated in separate packages, then manufacturing simplicity is maintained, but signal transmission speed and conversion efficiency deteriorate
Solution Approach 1:
The patent merges optical components (photonic die) and electrical components (electronic die) into a single integrated package, eliminating the need for separate packages and interconnect interfaces. This integration enables direct optical-electrical signal conversion within the package, improving transmission speed and conversion efficiency while managing the increased structural complexity through systematic design of interconnect layers and bonding interfaces.
2Productivity
If optical and electrical components are integrated in the same package, then signal conversion efficiency is improved, but manufacturing complexity increases
Solution Approach 1:
The integrated package is segmented into distinct functional layers including a photonic die layer for optical signal processing, an electronic die layer for electrical signal processing, and intermediate interconnect layers for signal transmission between them. This segmentation allows each layer to be manufactured and optimized independently using specialized processes, then bonded together, thereby maintaining manufacturing feasibility while achieving high signal conversion efficiency through direct optical-electrical interfacing.
Solution Approach 2:
The patent introduces intermediate interconnect layers as mediators between the photonic die and electronic die. These interconnect layers include conductive traces, vias, and bonding interfaces that facilitate efficient signal transmission and power distribution. The intermediary structures enable direct optical-to-electrical signal conversion while managing the manufacturing complexity by providing standardized interfaces and routing paths that can be fabricated using established semiconductor processes.
3Loss of energy
If traditional interconnect structures are used, then device complexity is reduced, but signal loss and power consumption increase
Solution Approach 1:
The patent implements local quality optimization in the interconnect structures by using materials and geometries specifically tailored for high-speed signal transmission in critical paths. The interconnect layers incorporate low-loss dielectric materials, controlled impedance traces, and minimized via counts in signal paths to reduce signal loss and electromagnetic interference. This targeted optimization of local interconnect quality reduces signal loss and power consumption while managing overall device complexity through selective application of advanced interconnect techniques only where necessary for performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables enhanced high-speed operation and reduced signal loss by providing a robust interface for optical-electrical signal conversion, improving the performance of photonic systems and reducing power consumption.
Implementation Method 1
a photonic package including a waveguide structure
Implementation Method 2
a photodetector that is optically coupled to the waveguide
Data Source
AI summary
A package includes an interposer structure including a first via; a first interconnect device including conductive routing and which is free of active devices; an encapsulant surrounding the first via and the first interconnect device; and a first interconnect structure over the encapsulant and connected to the first via and the first interconnect device; a first semiconductor die bonded to the first interconnect structure and electrically connected to the first interconnect device; and a first photonic package bonded to the first interconnect structure and electrically connected to the first semiconductor die through the first interconnect device, wherein the first photonic package includes a photonic routing structure including a waveguide on a substrate; a second interconnect structure over the photonic routing structure, the second interconnect structure including conductive features and dielectric layers; and an electronic die bonded to and electrically connected to the second interconnect structure.