Photonic Integrated Substrate With Vertical Optical Paths
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Solution Overview
Problem
The increasing demand for high-bandwidth communication signals to support data-intensive applications like IoT, AR, VR, and autonomous driving requires optical communication signals that can efficiently handle large data volumes with reduced energy loss and power consumption.
Innovation Solution
A photonic integrated circuit embedded substrate with an optical path extending vertically through stacked insulating layers, reducing horizontal signal paths and incorporating a base substrate with overlapping optical paths to minimize energy loss and enable a more compact design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If optical communication signals are used to increase bandwidth and reduce energy loss, then communication efficiency is improved, but the complexity of the photonic integrated circuit structure increases
Solution Approach 1:
The patent transitions from planar signal routing to three-dimensional vertical stacking by extending optical paths through multiple insulating layers in the stacking direction. This dimensional change allows signals to travel vertically through the substrate rather than horizontally across the surface, reducing the overall signal path length and improving communication efficiency while managing structural complexity through systematic layer organization.
Solution Approach 2:
The patent embeds multiple functional layers within a nested structure where insulating layers, conductive layers, and optical paths are stacked within each other. The first insulating layer contains optical paths that are nested within the substrate structure, with subsequent layers wrapping around or adjacent to these paths, creating a compact nested architecture that improves efficiency without proportionally increasing complexity.
2Ease of manufacture
If horizontal signal paths are used in conventional substrates, then manufacturing is simpler, but energy loss increases and compact design is limited
Solution Approach 1:
The patent replaces horizontal signal paths with vertical optical paths extending through the stacking direction of multiple insulating layers. This dimensional transition reduces the total path length signals must travel, thereby minimizing energy loss. The vertical routing is achieved by forming optical paths within the thickness direction of the substrate, allowing signals to traverse the substrate more efficiently than conventional planar routes.
3Adaptability or versatility
If conventional substrate structures are used, then design flexibility is limited, but structural compactness is easier to achieve
Solution Approach 1:
The patent utilizes the stacking direction (thickness dimension) to route optical paths vertically through multiple insulating layers, rather than confining all paths to the planar surface. This three-dimensional routing approach enables more compact substrate design by reducing the horizontal footprint while maintaining design flexibility through configurable vertical path lengths and layer arrangements.
Solution Approach 2:
The patent segments the substrate into multiple stacked insulating layers, each containing portions of optical paths. This segmentation allows independent optimization of each layer's thickness and path configuration, providing design flexibility while achieving compact overall volume. The segmented structure enables flexible routing decisions at each layer without constraining the entire substrate design.
Data Source
AI summary
A photonic integrated circuit embedded substrate may include: an embedded insulating layer on which a photonic integrated circuit is disposed, and at least one first insulating layer stacked on one surface of the embedded insulating layer. The at least one first insulating layer may have an optical path extending in a stacking direction of the at least one first insulating layer.