Photoresist Composition for High-Resolution Negative Patterns
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Solution Overview
Problem
Current photoresist compositions for forming negative patterns lack effective resolution and adhesiveness, particularly when exposed to different radiation sources like KrF excimer lasers or electron beams, due to limitations in acid-labile groups and solvent solubility.
Innovation Solution
A photoresist composition comprising a resin with structural units represented by specific formulas, including acid-labile groups and fluorine-containing alkyl groups, combined with an acid generator and a salt, which increases solubility in organic solvents upon acid action, enhancing pattern resolution and adhesiveness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional photoresist compositions are used for negative pattern formation, then the process is simple, but the resolution and adhesiveness are insufficient
Solution Approach 1:
The patent uses a composite resin system comprising multiple resin components (including fluorine-containing resins and resins with specific functional groups) combined with specific acid generators and salts. This composite approach enables simultaneous improvement of resolution, adhesiveness, and etch resistance by leveraging the complementary properties of different materials working together.
Solution Approach 2:
The patent modifies chemical parameters of the photoresist composition by introducing specific fluorine-containing groups (R2 in formula I), controlling the types and concentrations of acid generators (formula II), and adjusting salt additives (formula B1). These parameter changes optimize the acid-labile group behavior and solvent interactions to achieve superior pattern resolution and adhesiveness.
2Strength
If conventional photoresist compositions are used, then the composition is simple, but resistance to dry-etching is insufficient
Solution Approach 1:
The patent employs a composite material system where fluorine-containing resins (providing etch resistance) are combined with resins containing acid-labile groups (enabling pattern formation). The synergistic interaction between these components, along with specific acid generators and salts, creates a composition that simultaneously achieves high etch resistance and good pattern resolution.
Solution Approach 2:
The patent introduces fluorine atoms at specific locations within the resin structure (R2 group in formula I) to create localized regions of high etch resistance. This local modification allows the photoresist to maintain good overall properties while having specific areas resistant to dry-etching, without compromising pattern resolution.
3Manufacturing precision
If acid-labile groups are modified to improve resolution, then pattern resolution improves, but solubility control becomes difficult
Solution Approach 1:
The patent introduces salts (formula B1) as intermediary substances that mediate between the acid-labile groups and the solvent system. These salts control the acid generation process and regulate solubility behavior during development, allowing precise control over pattern formation while maintaining good solubility characteristics. The salt acts as a mediator that balances resolution enhancement with solubility control.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition provides improved resolution and resistance to dry-etching, with optimal performance across various exposure sources, including KrF excimer lasers and electron beams, by controlling acid generation and solvent interaction.
Implementation Method 1
a compound which generates an acid by irritation of active light or radiant lay
Implementation Method 2
a resin which increases in its polarity by action of an acid and which shows increased solubility in positive developer and decreased solubility in negative developer by irritation of active light or radiant lay
Data Source
AI summary
A photoresist composition comprisinga resin which comprises a structural unit represented by formula (I);wherein R1 represents a hydrogen atom or a methyl group, andR2 represents C1-C10 hydrocarbon group; anda resin which comprises a structural unit having an acid-labile group and no structural unit represented by formula (I); andan acid generator represented by formula (II):wherein X2 represents a C1-C6 alkanediyl group where a hydrogen atom can be replaced by a hydroxyl group or a group —O—R5 and where a methylene group can be replaced by an oxygen atom or a carbonyl group,R4 and R5 each independently represent a C1-C24 hydrocarbon group where a hydrogen atom can be replaced by a fluorine atom or a hydroxyl group and where a methylene group can be replaced by an oxygen atom or a carbonyl group, andZ+ represents an organic cation.